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Novel chemical copper plating method

A new type of electroless copper plating technology, applied in the process of pre-soaking, activation, degumming steps, degreasing and hole drilling, it can solve the problems of excessive acid mist, unstable activation performance of ion palladium, etc., and achieve high reliability Effect

Active Publication Date: 2011-02-23
江苏矽智半导体科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide a novel electroless copper plating method for the unstable activation performance of traditional ionic palladium or the excessive acid mist of acidic colloidal palladium. Cost-effective, easy-to-control method for electroless copper plating on printed circuit (PCB) boards

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0036] A novel electroless copper plating method, comprising the following steps:

[0037] 1. Degreasing the whole hole

[0038] (1), take 0.1g of op emulsifier, 1.0g of sodium phosphate, and 1.5g of Rhodafac RA-600 surfactant, first dissolve the taken solutions with a small amount of water, and then mix and dilute to 1 liter;

[0039] (2), soak the PCB board in the above mixed solution, the time is controlled at 6 minutes, the pH value is 8, and the temperature is controlled at 55 degrees Celsius;

[0040] During the process of degreasing and finishing the hole, the workpiece is shaken to make the combined solution in the hole have a certain flow.

[0041] This step is mainly to remove oil stains and oxide films on the copper surface, and more importantly, to adjust the charge in the hole to make the surface negatively charged.

[0042] 2. Washing

[0043] Put the PCB board after degreasing and hole drilling into water for washing. The number of times of washing is two tim...

Embodiment 2

[0069] A novel electroless copper plating method, comprising the following steps:

[0070] 1. Degreasing the whole hole

[0071] (1), take 0.5g of op emulsifier, 2.5g of sodium phosphate, and 1.5g of Rhodafac RA-600 surfactant, first dissolve the taken solution with a small amount of water, and then mix and dilute to 1 liter;

[0072] (2) Soak the PCB board in the above mixed solution at a temperature of 50 degrees Celsius for 6 minutes and a pH value of 10.

[0073] 2. Washing

[0074] Put the PCB board after degreasing and hole drilling into water for washing. The number of times of washing is two times, and the excess surfactant on the copper surface is cleaned.

[0075] 3. Microetching

[0076] Put the washed PCB board into 100g / L sodium persulfate and 30g / L sulfuric acid solution.

[0077] When performing this step, the solution should be stirred with air for 2 minutes at room temperature, and the PCB components should be taken out for cleaning.

[0078] 4. Prepreg ...

Embodiment 3

[0095] A novel electroless copper plating method, comprising the following steps:

[0096] 1. Degreasing the whole hole

[0097] (1), get op emulsifier 10g, sodium phosphate 5.0g, Rhodafac RA-600 surfactant 5.0g, first described combined solution is dissolved with a small amount of water respectively, then mixed and diluted to 1 liter;

[0098] (2) Soak the PCB board in the above mixed solution, the temperature is 45 degrees Celsius, the time is 2 minutes, and the pH value is 14.

[0099] 2. Washing

[0100] Put the PCB board after degreasing and hole drilling into water for washing. The number of times of washing is two times, and the excess surfactant on the copper surface is cleaned.

[0101] 3. Microetching

[0102] Put the washed PCB board into 100g / L sodium persulfate and 30g / L sulfuric acid solution for 1 minute at room temperature, then take out the PCB board for cleaning.

[0103] 4. Prepreg

[0104] (1), get 100ml of hydrochloric acid, 50g of stannous chloride, ...

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Abstract

The invention discloses a novel chemical copper plating method. The method comprises steps of degreasing and hole finishing, washing, micro etching, pre-impregnation, activation, washing, dispergation, washing and chemical copper plating. The method is characterized in that: in the degreasing and hole finishing step, a circuit board can be degreased, and more important, high negative electricity is carried in the hole and can adsorb more palladium colloid so that the backlight of a copper layer reaches over level 9; salt-based ammonium sulfate and palladium sulfate solution is adopted in the activation step, and acid mist produced by the traditional palladium colloid is not produced, so the method is environment-friendly and has no any injury to the operating personnel; and in the dispergation step, sulfuric acid and hydrazine sulfate are used for removing ammonium radicals, and the hydrazine can reduce palladium metal into palladium atoms, so copper is better deposited.

Description

【Technical field】 [0001] The present invention relates to a kind of plastic, glass, printed circuit (PCB) board electroless copper plating method, relate to plastic, glass, printed circuit (PCB) board electroless copper plating method in degreasing whole hole, prepreg , activation, degumming steps of the process. 【Background technique】 [0002] At present, with the rapid development of global electronic information technology and communication technology, the printed circuit (PCB) industry has become the largest pillar of the electronic component manufacturing industry worldwide. With the gradual transfer of the global PCB industry to my country, my country's PCB industry has also developed rapidly since the 1990s. It is predicted that with the continuous advancement of my country's manufacturing power to a manufacturing power and the further development of the electronic information industry, my country's PCB output will reach 245 million square meters by 2012. [0003] I...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/18C23C18/38
Inventor 王江锋
Owner 江苏矽智半导体科技有限公司
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