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Welding method of tungsten-titanium alloy target

A technology of tungsten-titanium alloy and welding method, which is applied in welding equipment, metal processing equipment, manufacturing tools, etc., can solve large deformation, cannot meet the requirements of sputtering process, and has low welding strength between tungsten-titanium alloy target and copper backplane and other problems to achieve the effect of improving welding strength and ensuring welding strength

Inactive Publication Date: 2011-02-16
KONFOONG MATERIALS INTERNATIONAL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The invention is made to solve the problems that the welding strength between the tungsten-titanium alloy target and the copper back plate is low, which cannot meet the requirements of the sputtering process, and will cause large deformation when the target area is large.

Method used

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Embodiment Construction

[0027] The inventor of the present invention found that the welding quality of the existing tungsten-titanium alloy target assembly and the backplane, especially the copper backplane, cannot meet the high-strength requirements of the sputtering process.

[0028] The present invention provides a welding method of a target assembly, which includes: providing a tungsten-titanium alloy target, a back plate and solder; performing nickel plating treatment on the bonding surface of the tungsten-titanium alloy target; Preheating, so that the solder is distributed on the bonding surface of the tungsten-titanium alloy target; preheating the back plate, so that the solder is distributed on the bonding surface of the back plate; making the bonding surface of the tungsten titanium alloy target The bonding surface of the back plate is attached and welded to form a target assembly; the target assembly is cooled.

[0029] Since the welding performance of the tungsten-titanium alloy target and the ...

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Abstract

The invention discloses a welding method of a tungsten-titanium alloy target, comprising the following steps: providing a tungsten-titanium alloy target, a rear panel and a welding flux; performing nickel plating process on the joint surface of the tungsten-titanium alloy target; preheating the tungsten-titanium alloy target to distribute the welding flux on the joint surface of the tungsten-titanium alloy target; preheating the rear panel to distribute the welding flux on the joint surface of the rear panel; attaching and welding the joint surfaces of the tungsten-titanium alloy target and the rear panel to form a target component; and cooling the target component. The welding method of the tungsten-titanium alloy target of the invention can bind the tungsten-titanium alloy target and the rear panel together, in particular can bind the tungsten-titanium alloy target and the copper rear panel together with higher intensity to meet the requirement of high intensity for the sputtering technology. In addition, the method can effectively restrain the greater deformation, warping and the like of the target component, especially of the tungsten-titanium alloy target even though the area of the target is larger.

Description

Technical field [0001] The invention relates to the field of semiconductor manufacturing, in particular to a welding method of a tungsten-titanium alloy target. Background technique [0002] Sputtering coating is a common process in semiconductor production. In the sputtering coating process, the backplane is usually used to fix the target for sputtering, that is, the target is connected to the backplane by welding, bolting, etc. Fix it. Here, the target material for sputtering and the back plate for fixing the target material that are connected together are called a target material assembly, and the back plate is used to assemble the target material to the sputtering base, and It also has the effect of conducting heat. [0003] Due to the different target material, the type of solder used in soldering, soldering conditions, etc. are also different. In addition, the backplanes widely used in production are mainly copper targets. At present, the welding between tungsten titanium...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K1/00B23K1/19B23K1/20B23K1/06
Inventor 姚力军潘杰王学泽陈勇军
Owner KONFOONG MATERIALS INTERNATIONAL CO LTD
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