Method for repairing broken circuit or mutilation of copper bonding pad and repair structure thereof
An incomplete and brazing technology, which is applied in the field of circuit break repair of printed circuit boards, can solve problems such as non-solderability, poor appearance quality of printed circuit boards, contact, etc., and achieve fast results
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[0023] See 1 and figure 2 , to describe the embodiment of the present invention in more detail.
[0024] Such as figure 1 , is a flow chart of a copper pad disconnection or incomplete repair method of the present invention. The first step is to first coat a layer of conductive paste accounting for 1 / 3 of the total repair thickness on the copper pad wire disconnection position or incomplete part as the base layer, the conductive paste is silver paste, and the silver paste After being baked, it is thermally cured into a silver paste layer, and this layer of silver paste layer is used as the basis for the conductive layer and subsequent repairs. In the second step, on the silver paste layer, a layer of first copper layer is brush-plated. The first copper layer is an electroplating potion using copper nitrate solution, and a layer of copper layer is brush-plated. The first copper layer accounts for about 1 / 3 of the total repair thickness. In the third step, on the basis of t...
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