Nano-silicon thin-membrane four-island-beam-membrane sensor chip and preparation method thereof
A technology of nano-silicon thin film and membrane sensor, which can be used in instruments, manufacturing microstructure devices, piezoelectric devices/electrostrictive devices, etc., can solve problems such as difficult pressure measurement, and achieve the effect of improving sensitivity and linearity
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[0061] Example: Preparation of sensor chip
[0062] Use double-sided polished n-type (100) crystal orientation single crystal silicon wafer with a thickness of 200±10μm and a resistivity of 5-8Ω·cm. The chip manufacturing process is as follows:
[0063] 1. Thermal oxidation
[0064] A dry-wet-dry oxidation process is used to grow an oxide layer with a thickness of 100nm on the upper and lower surfaces of the silicon wafer. Oxidation temperature is 1150℃, dry oxygen for 10 minutes, steam wet oxygen for 30 minutes, and dry oxygen for 10 minutes.
[0065] 2. Double-sided lithography alignment mark
[0066] Double-sided photoetching of the oxidized silicon wafer to form double-sided alignment marks. Glue is applied on the back side, and the pre-baking temperature is 80°C for 8 minutes, and then the glue is applied on the front side, and the pre-baking temperature is 80°C, and the time is 15 minutes. Expose, develop and etch the alignment marks. (Simultaneously lithographically align the...
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