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Method for preparing fine Mo-Ru solder powder

A technology of powder preparation and mo-ru, which is applied in the field of preparation of fine Mo-Ru solder powder by chemical reaction co-precipitation method, can solve the problems of uneven composition and poor processability, and achieve the effect of uniform composition

Inactive Publication Date: 2010-11-24
SINO PLATINUM METALS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The invention can solve the deficiencies such as uneven composition and poor processability in the use of Mo-Ru solder in the prior art.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0014] Example 1 A solder composition (mass fraction): 58% Mo-42% Ru solder powder preparation method, according to the solder design mass fraction of 58% Mo-42% Ru composition, according to the molecular formula of ruthenium trichloride and Ammonium molybdate molecular formula, in which the atomic weight of each element, calculate the required weight of ruthenium trichloride and ammonium molybdate, and then separately make solutions with distilled water, mix and dry at 100°C. Then, the dried mixture is heated to remove ammonium chloride, and the heating is carried out at 400°C; finally, the mixture is reduced with hydrogen under high temperature conditions, the treatment temperature is 900°C, time: 2h, after the mixture is cooled, Grind and sieving to produce Mo-Ru solder powder with required composition and specifications.

[0015] The particle size of the Mo-Ru solder powder prepared by the above method; 90% of the powder particle size is less than or equal to 6 microns, the m...

Embodiment 2

[0018] Method for preparing solder composition (mass fraction): 56% Mo-44% Ru solder powder

[0019] According to the design of the solder composition of 56% Mo-44% Ru, the required weights of ruthenium trichloride and ammonium molybdate are calculated, and then the solutions are made into solutions with ionized water, mixed, and dried at 150°C. Then, the dried mixture is heated to remove ammonium chloride, and the heating is performed at 500°C; finally, the mixture is subjected to reduction treatment with hydrogen under high temperature conditions, and the treatment temperature is 950°C. After the mixture is cooled, it is ground and sieved to prepare Mo-Ru solder powder with required composition and specifications.

[0020] The Mo-Ru prepared by the above method has the particle size of the Mo-Ru solder powder prepared by the above method; the particle size of 92% powder is ≤6 microns, the maximum particle size is ≤9.4 microns, and 90% of the powder particles are composed of Mo-Ru...

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Abstract

The invention discloses a method for preparing Mo-Ru solder powder by using a chemical coprecipitation method. The method comprises the following steps of: preparing solution of ruthenium trichloride and solution of ammonium molybdate respectively; mixing the solution of ruthenium trichloride and the solution of ammonium molybdate and drying the mixed solution at a low temperature; heating the obtained product to remove ammonium chloride; reducing the product with hydrogen; and grinding and sieving the product to prepare the required ingredient, namely Mo-Ru solder powder, wherein the particle size of 90 percent of the solder powder is less than or equal to 6 microns, and the maximum particle size is less than or equal to 10 microns. The Mo-Ru solder powder prepared by the method has the characteristics of fine solder powder (the particle size of 90 percent of the particles is less than or equal to 6 microns) and uniform ingredients, so that the method can solve the problems of non-uniform ingredients, poor manufacturability and the like existing in the use of the Mo-Ru solder in the prior art.

Description

Technical field [0001] The invention relates to a manufacturing method of Mo-Ru powder, in particular to a preparation process for preparing fine Mo-Ru solder powder by a chemical reaction co-precipitation method. Background technique [0002] In the field of electric vacuum device manufacturing, a high-temperature solder, Mo-Ru alloy solder, is used. The composition of the solder is located at the Mo-Ru eutectic point, Mo-43.27Ru, and the melting point of the solder is 1920-1980°C. [0003] Because the alloy has a high melting point, it is difficult to prepare by traditional aerosolization method. Therefore, in the existing technology, pure Mo powder and pure Ru powder are used for mechanical mixing according to the required ratio of the alloy to make design requirements Mo-Ru solder powder of the composition or the Mo-Ru alloy ingot mechanical crushing-grinding method is used to prepare Mo-Ru solder powder. Because the solder component is located in the eutectic component, under...

Claims

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Application Information

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IPC IPC(8): B22F9/22
Inventor 陈南光庄滇湘赵永坤
Owner SINO PLATINUM METALS CO LTD
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