LED chip and manufacturing method thereof
A technology of light-emitting diodes and manufacturing methods, which is applied in the field of lighting, can solve problems such as reducing the area of light-emitting diodes, achieve uniform current distribution, improve luminous efficiency, and increase the effect of light-emitting area
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[0024] refer to figure 2 As shown, an embodiment of the light-emitting diode chip manufacturing method of the present invention includes:
[0025] Step s1, forming a light-emitting epitaxial stack on the substrate, which sequentially includes: forming an n-type interface layer on the substrate; forming a light-emitting layer on the n-type interface layer; forming a p-type interface layer on the light-emitting layer;
[0026] Step s2, forming a conductive layer on the light-emitting epitaxial stack;
[0027] Step s3, dicing the substrate having the light-emitting epitaxial stack and the conductive layer;
[0028] Step s4, bonding the back of the diced substrate to the external electrode layer;
[0029] Step s5, forming a conductive portion on the sidewall of the n-type interface layer after scribing, and the conductive portion electrically connects the n-type interface layer to the external electrode layer;
[0030] Step s6, forming a p-electrode on the diced conductive lay...
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