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Multilayered structural polymer-based dielectric composite material and preparation method thereof

A technology of composite materials and polymers, applied in fixed capacitor dielectrics, chemical instruments and methods, circuits, etc., can solve problems such as high dielectric constant, stress cracking, simple molding process, etc., and achieve low molding temperature and good bonding performance , the effect of high dielectric constant

Inactive Publication Date: 2010-11-10
BEIJING UNIV OF CHEM TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

The dielectric constant of this composite material reaches 60 when the volume fraction of PZT is 50%. , the adhesion between the material and the circuit board and electrodes will be significantly reduced, which will easily cause stress cracking
[0006] The polymer-based dielectric composite materials reported so far cannot meet the requirements of high dielectric constant, good bonding performance, and simple molding process at the same time.

Method used

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  • Multilayered structural polymer-based dielectric composite material and preparation method thereof
  • Multilayered structural polymer-based dielectric composite material and preparation method thereof
  • Multilayered structural polymer-based dielectric composite material and preparation method thereof

Examples

Experimental program
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Effect test

Embodiment 1

[0027] 1) 0.7263g of BaTiO with a particle size of 95-105nm 3 Add 13mL DMAc, stir magnetically at 65°C for 9min, oscillate ultrasonically for 9min, and stir magnetically at 65°C for 9min to obtain BaTiO 3 2g PVDF was added to 22mL DMAc and stirred magnetically at 65°C for 35min to obtain a PVDF solution; after mixing the two, evaporated to a volume of 22mL with magnetic stirring at 65°C; Coat a thin film on a glass plate, and keep the temperature at 65°C for 130min to obtain BaTiO 3 The volume fraction is 10%, and the thickness is a film (1) of 37 μm;

[0028] 2) 1.6341g of BaTiO with a particle size of 95-105nm 3 Add 28mL DMAc, stir magnetically at 65°C for 9min, oscillate ultrasonically for 9min, and stir magnetically at 65°C for 9min to obtain BaTiO 3 2g PVDF was added to 22mL DMAc and stirred magnetically at 65°C for 35min to obtain a PVDF solution; after mixing the two, evaporated to a volume of 22mL with magnetic stirring at 65°C; Coat a thin film on a glass plate, a...

Embodiment 2

[0031] 1) 0.7263g of BaTiO with a particle size of 95-105nm 3 Add 15mL DMAc, stir magnetically at 70°C for 10min, oscillate ultrasonically for 10min, and stir magnetically at 70°C for 10min to obtain BaTiO 3 2g PVDF was added to 25mL DMAc, and stirred magnetically at 70°C for 30min to obtain a PVDF solution; after mixing the two, evaporated to a volume of 25mL with magnetic stirring at 70°C; Coat a thin film on a glass plate, and keep the temperature at 70°C for 120min to obtain BaTiO 3 The volume fraction is 10%, and the thickness is a film (1) of 36 μm;

[0032] 2) 2.8013g of BaTiO with a particle size of 95-105nm 3 Add 30mL DMAc, stir magnetically at 70°C for 10min, oscillate ultrasonically for 10min, and stir magnetically at 70°C for 10min to obtain BaTiO 3 suspension; 2g PVDF was added to 25mL DMAc, and magnetically stirred at 70°C for 30min to obtain a PVDF solution; after mixing the two, magnetically stirred at 70°C and evaporated to a volume of 28mL; Coat a thin fi...

Embodiment 3

[0035] 1) 0.7263g of BaTiO with a particle size of 95-105nm 3Add 20mL DMAc, stir magnetically at 72°C for 10min, oscillate ultrasonically for 10min, and stir magnetically at 72°C for 10min to obtain BaTiO 3 2g PVDF was added to 27mL DMAc, and stirred magnetically at 72°C for 32min to obtain a PVDF solution; after mixing the two, evaporated to a volume of 26mL with magnetic stirring at 72°C; Coat a thin film on a glass plate, and keep the temperature at 72°C for 115min to obtain BaTiO 3 The volume fraction of is 10%, the film (1) that thickness is 44 μ m;

[0036] 2) 4.3575g of BaTiO with a particle size of 95-105nm 3 Add 35mL DMAc, stir magnetically at 72°C for 10min, oscillate ultrasonically for 10min, and stir magnetically at 72°C for 10min to obtain BaTiO 3 2g PVDF was added to 27mL DMAc, and stirred magnetically at 72°C for 32min to obtain a PVDF solution; after mixing the two, evaporated to a volume of 30mL with magnetic stirring at 72°C; Coat a thin film on a glass p...

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Abstract

The invention relates to a multilayered structural polymer-based dielectric composite material and a preparation method thereof, which belong to the field of dielectric substance. The traditional polymer-based dielectric composite material can not take both dielectric constant and adhesive property into account and has complicated preparation process. The composite material provided by the invention comprises three layers of films which are superimposed together; the volume part of a polymer in an outer-layer film is 90 percent, and the volume part of inorganic ceramic particles is 10 percent; and the volume part of the polymer in a middle-layer film is 50 to 80 percent, and the volume part of the inorganic ceramic particles is 20 to 50 percent. In the invention, after the outer-layer film and the middle-layer film are respectively prepared by using the polymer as a basal body and the inorganic ceramic particles as a disperse phase and adopting a spin coating technology, the outer-layer film and the middle-layer film are combined together by adopting a hot pressing process to obtain the multilayered structural polymer-based dielectric composite material. The composite material provided by the invention has the advantages of high dielectric constant, good adhesive property, simple preparation process and the like.

Description

technical field [0001] The invention belongs to the field of dielectric materials, and in particular relates to a polymer-based dielectric composite material with a multilayer structure and a preparation method thereof. Background technique [0002] The polymer-based dielectric composite material has the advantages of good flexibility and low molding temperature, thereby overcoming the shortcomings of traditional ceramic dielectric materials such as high brittleness and high sintering temperature. With the development of the electronics industry towards miniaturization, embedded capacitors have been widely used, and polymer-based dielectric composites are ideal dielectric materials for embedded capacitors. [0003] At present, the preparation of polymer-based dielectric composites mainly adopts melt blending or solution blending methods to uniformly disperse ceramic particles with high dielectric constant in the polymer matrix. [0004] For example, in "Dielectric propertie...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01G4/06H01B3/00B32B27/20C08L27/16C08L23/12C08L27/06C08K3/24C08J5/18B29C70/30
Inventor 党智敏杨泰查俊伟
Owner BEIJING UNIV OF CHEM TECH
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