A vapor chamber with composite capillary structure of metal foam and copper powder

Abstract

The patent of the present invention discloses a vapor chamber with a composite capillary core structure of metal foam and copper powder. Its main body is a vacuum chamber composed of an upper cover and a lower cover. There is a composite capillary core composed of foam metal and copper powder in the cavity. The structure is filled with a certain amount of low temperature boiling heat transfer fluid. The upper and lower covers are made of deoxidized copper plates. Composite capillary core structure is composed of metal foam plate and copper powder of a certain size through solid phase sintering. Compared with the traditional capillary core structure, it has significant advantages such as large capillary force in the lower layer, small penetration resistance in the upper layer, precise control of capillary force, and small contact thermal resistance; The capillary core structure of the upper and lower cover plates can be designed as one, which improves the return capacity. Compared with the traditional products, the vapor chamber with the composite capillary core structure of metal foam and copper powder has the advantages of low cost, high heat dissipation efficiency and long service life under the same heat dissipation effect.

Description

technical field [0001] The invention belongs to a soaking plate for heat dissipation, in particular to a soaking plate with a composite capillary structure of foamed metal and copper powder. Background technique [0002] With the development of microelectronics technology, the calorific value per unit area of ​​electronic components is continuously increasing, but the volume is required to be smaller and smaller. Therefore, the heat dissipation problem of high heat flux components has become one of the key technical issues affecting the design of electronic devices. In the past two years, the traditional air-cooled heat dissipation has reached the limit of its heat dissipation capacity, while the liquid-cooled heat dissipation method has disadvantages such as high cost, complex structure, and risk of leakage that restrict its popularization and development. With the improvement of heat dissipation requirements, phase change heat dissipation elements made of the principle of ...

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Problems solved by technology

[0003] The technical problem to be solved by the patent of the present invention is the problem of low performance of the capillary core with a single structure. Provide a vapor chamber with a composite capillary core structure of metal foam and copper powder that has a small penetration resistance and provides a large capillary force for the working medium.

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