High-density rack server radiating system

Abstract

The invention relates to a high-density rack server radiating system, which comprises an axial fan group, a radiator and a case body, wherein the axial fan group and the radiator are installed in the case body; the axial fan group comprises a plurality of fans; the radiator is made of fin-shaped aluminum profiles, wherein the number of CPU chip radiators can be 4-16, and the number of Chipset and communication chip radiators can be 2-6 respectively; the CPU chip radiators are axially arranged in two rows along the fans in front and at the back of the case and are covered on the surface of a CPU chip; and the case body is a box type galvanized steel sheet, comprises a front panel, a back panel, an upper panel, a lower panel, a left panel and a right panel, and is fixed by adopting L-shaped side lugs. The invention overcomes the defects of the traditional radiating system, enables radiating elements to have lower temperature and be more balanced, provides secure thermal environment guarantee for stable operation and longer service life of the whole server system, and has good practical value and popularization prospect in the technical field of computer servers.

Description

(1) Technical field [0001] The invention relates to a cooling system for high-density rack servers. It belongs to the field of computer technology. (2) Background technology [0002] Research has shown that thermal failure is one of the major failure modes of electronic equipment, including computers. As the temperature increases, the failure rate of electronic equipment increases exponentially, and even for some devices, the failure rate more than doubles when the ambient temperature rises by 10°C (called the 10°C rule). An increase in the operating temperature of the chip will cause electron migration in the semiconductor, which will cause the chip to fail or even burn out. [0003] Thermal environmental stress due to heat is an important working stress, and statistics show that 70% of electronic equipment failures are related to excessive thermal environmental stress. Therefore, for electronic equipment, even if it is lowered by 1°C, the failure rate of the equipment w...

AI Technical Summary

Problems solved by technology

Its disadvantages are as follows: first, the horizontal length of 1U is fixed, and the number of fans with standard industrial product specifications that can be installed is limited; second, more fans and higher speeds make the server more noisy

Its disadvantage is that when the chassis is small, the vertical wind pressure generated by the fan on the radiator will have a negative impact on the lateral convection inside and outside the chassis. The temperature rises, and the high temperature in the chassis in turn affects the heat dissipation effect of the radiator.

The disadvantage is that the air duct itself occupies a certain space, and the cycle of custom design is longer

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