MEMS presser sensor chip and manufacturing method thereof

Abstract

The invention relates to an MEMS presser sensor chip, which can effectively improve sensitivity of a chip and enhance yield of the chip. The presser sensor chip comprises a silicon slice, a vacuum cavity, a glass substrate, a sensitive resistor configuration region, an outer electric connecting piece of the sensitive resistor configuration region and an alignment mark component and is characterized in that: the four corners of the positive face and the negative face of the silicon slice are respectively provided with an alignment mark structure; the maximum stress linear region of the positive face of the silicon slice is the sensitive resistor configuration region which is rectangular and comprises a piezoresistor, p+connection, an N+ isolation groove and an aluminum electrode; and the piezoresistor consists of two pairs of bridging resistors concretely, each bridging resistor comprises one pair of sensitive resistors which are linear resistors, each bridging resistor in each pair of the bridging resistors is arranged at two opposite sides of the four sides of the sensitive resistor configuration region respectively in a symmetric manner, and each bridging resistor is encircled by the N+ isolation groove.

Description

(1) Technical field [0001] The invention relates to the field of micro-electro-mechanical system (MEMS) pressure-sensitive chips, in particular to a MEMS pressure-sensitive chip, and also relates to a manufacturing method of the chip. (2) Background technology [0002] Micromechanical sensitive devices based on microelectromechanical systems (MEMS) have been widely used and developed rapidly due to their small size, low cost, simple structure, and integration with processing circuits. [0003] As the core device of the pressure sensor, the pressure sensitive chip is the earliest commercial product in the microelectromechanical system (MEMS). The piezoresistive sensitive chip has been more and more widely used due to its advantages of large output signal and simple signal processing. The detection of atmospheric pressure has many important applications, such as predicting weather changes and measuring altitude. For pressure sensitive devices that detect atmospheric pressure,...

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Problems solved by technology

[0004] The existing MEMS pressure-sensitive chip manufacturing method adopts the process of corroding the back cavity first and then forming an electrical connection, which will cause a high fragmentation rate during operation, thereby reducing the yield of the chip; in addition, using the existing MEMS pressure-sensitive chip. method, the photosensitive effect and hysteresis effect of the manufactured piezoresistor and its electrical connection are long, and the stress concentration of the piezoresistor structurally arranged on the chip is low, resulting in low sensitive linearity of the chip

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