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Poly(arylene sulfide) resin composition, process for production thereof, and surface mount electronic component

A technology of polyarylene sulfide and resin composition, which is applied in the direction of electrical components, electrical solid devices, semiconductor/solid device parts, etc., and can solve the problem of lower mechanical properties such as bending strength, easy foaming, and more decomposition gases and other problems, to achieve the effects of small change in mechanical strength, excellent heat resistance, and excellent flame retardancy

Active Publication Date: 2010-06-30
DIC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the resin composition obtained by mixing polyarylene sulfide resin and polyamide, since polyarylene sulfide has the effect of decomposing polyamide, has a lot of decomposed gas during melting and kneading. The appearance of electronic components after reflow soldering is prone to blistering (blister), in addition, it will also reduce mechanical properties such as bending strength after passing through a reflow soldering furnace

Method used

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  • Poly(arylene sulfide) resin composition, process for production thereof, and surface mount electronic component
  • Poly(arylene sulfide) resin composition, process for production thereof, and surface mount electronic component
  • Poly(arylene sulfide) resin composition, process for production thereof, and surface mount electronic component

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Embodiment 1～6 and comparative example 1～5

[0159] According to the compounding ratio recorded in Table 1, polyarylene sulfide, aromatic polyamide and other compounding materials (except glass fiber chopped strand mat) were mixed uniformly with a drum machine. Thereafter, the above-mentioned compounding materials were charged into a twin-screw extruder "TEM-35B" with a vent hole manufactured by Toshiba Machine Co., Ltd. The ratio of the distance of the machine to the total length of the screw: 0.28) A glass fiber chopped strand mat with a fiber diameter of 10 μm and a length of 3 mm is supplied at a ratio of 40 parts by mass to 60 parts by mass of the above-mentioned compounding material, and the discharge amount of the resin component is 25 kg / hr, screw rotation speed 250rpm, ratio of resin component discharge volume (kg / hr) to screw rotation speed (rpm) (discharge volume / screw rotation speed) = 0.1 (kg / hr·rpm), set resin temperature at 330°C Melt kneading to obtain pellets of the resin composition.

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Abstract

Disclosed is a poly(arylene sulfide) resin composition which contains a poly(arylene sulfide) (A) and a polyamide (B) as essential components, and further contains an organic phosphorus compound (C) selected from the group consisting of an aromatic phosphite compound and an aromatic phosphonite compound and an inorganic phosphorus compound (D) selected from the group consisting of a metal salt of phosphorous acid and a metal salt of hypophosphorous acid as additional essential components. Also disclosed is a process for producing the poly(arylene sulfide) resin composition. Further disclosed is a surface mount electronic component. The poly(arylene sulfide) resin composition has excellent heat resistance, does not cause the deterioration in mechanical strength including bend strength even when the resin composition is heat-treated under high temperature conditions by passing the resin composition through a reflow furnace, and has excellent flame retardancy.

Description

technical field [0001] The present invention relates to a polyarylene sulfide resin composition containing a polyarylene sulfide and an aromatic polyamide, a method for producing the same, and an electronic component for surface mounting. Background technique [0002] Polyarylene sulfide represented by polyphenylene sulfide has a high melting point, excellent flame retardancy, chemical resistance, and good fluidity during molding. Therefore, it is mainly used as an engineering plastic for injection molding in various It is widely used in various electronic components, mechanical components, and automotive components. [0003] In recent years, in the field of electrical and electronic industries, with the miniaturization of products and the improvement of productivity, the mounting method of resin-based electronic components on printed circuit boards is becoming known as the so-called surface mount method (hereinafter referred to as "SMT"). Mode".) Surface mount mode change....

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L81/02B29B7/88C08K3/32C08K5/526C08K5/5393C08L77/00H01L23/29H01L23/31
CPCC08K3/32C08K5/49C08L81/02C08L81/04C08L77/06H01L2924/09701H01L23/293H01L2924/0002C08L2666/20H01L2924/00C08L77/00C08K5/5393
Inventor 芳野泰之中濑广清根岸浩明山口洋平宜保新也
Owner DIC CORP
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