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Low-temperature solubilizer of organic solderability preservative and application method thereof

An application method and technology of solubilizing agent, applied in the direction of welding medium, welding equipment, welding/cutting medium/material, etc., can solve the problems of reducing economic benefits, pollution of working instruments, and precipitation of a large number of crystals

Inactive Publication Date: 2010-06-30
CHANGSHA UNIVERSITY OF SCIENCE AND TECHNOLOGY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

When the temperature is lowered, the imidazoles of OSP will precipitate a large number of crystals with the lowering of the temperature, resulting in greater pollution of the working tank and some working instruments on the production line, and reducing economic benefits

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 2

[0051] A low-temperature solubilizer is added to the main component of the organic flux, and the low-temperature solubilizer is measured by mass ratio as follows:

[0052] Tartaric acid, butyric acid (1:1) 0.15%

[0053] N-butylamine, triisopropanolamine (1:1) 0.3%

[0054] Phenylalcohol 4%

[0055] Formic acid 10%

[0056] Acetic acid 10%

[0057] Adjust the pH to 3.2 with ammonia.

[0058] Dilute to 100% with water.

[0059] Get the copper printed circuit board test piece and go through the treatment process of this kind of organic solder protection flux with comparative example 1.

[0060]The test piece was tested for tinning.

Embodiment 3

[0062] A low-temperature solubilizer is added to the main component of the organic flux, and the low-temperature solubilizer is measured by mass ratio as follows:

[0063] Citric acid 0.15%

[0064] n-Butylamine 0.3%

[0065] Isoamyl alcohol, butanol (2:1) 4%

[0066] Formic acid 10%

[0067] Acetic acid 10%

[0068] Adjust the pH to 3.2 with ammonia.

[0069] Dilute to 100% with water.

[0070] Get the copper printed circuit board test piece to go through the treatment process of this kind of organic flux with example one.

[0071] The test piece was tested for tinning.

[0072] The comparative data after comparative example 1, embodiment 2, embodiment 3 processing are as follows:

[0073] (1) Crystallization of organic soldering flux in three examples:

[0074]

[0075] The above data show that the stability of Examples 2 and 3 at low temperatures is obviously better than that of Comparative Example 1, that is, the low-temperature solubilizer of the present...

Embodiment 4

[0080] A low-temperature solubilizer is added to the main component of the organic flux, and the low-temperature solubilizer is measured by mass ratio as follows:

[0081] Propionic acid 0.15%

[0082] n-Butylamine 0.3%

[0083] Isoamyl Alcohol 4%

[0084] Formic acid 10%

[0085] Acetic acid 10%

[0086] Adjust the pH to 3.2 with ammonia.

[0087] Dilute to 100% with water.

[0088] Get the copper printed circuit board test piece to go through the treatment process of this kind of organic flux with example one.

[0089] The test piece was tested for tinning.

[0090] The comparative data after processing of embodiment 3 and embodiment 4 are as follows:

[0091] (1) The crystallization situation of organic soldering flux in two embodiments:

[0092]

[0093] (2) In the two embodiments, the organic solder protection film film thickness on the surface of the copper circuit board and the tin test situation on the copper surface thereof:

[0094]

[00...

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Abstract

The invention discloses low-temperature solubilizer of organic solderability preservative (OSP), which is mainly used for the technologies of anti-oxidation and soldering in manufacturing industry of printed-circuit boards. A layer of organic film is chemically grown on the surface of cleaning bare copper, wherein the film has oxidation resistance, thermal shock resistance and wet fastness for protecting the surface of copper. With the volatility of dissolvent of the organic solderability preservative and the dissolubility of main agent, low-temperature precipitated crystalloid is generated in the process of production to influence the practical use of the OSP technology. The patent improves the problems that the OSP has worse stability under low temperature and is easily crystallized, and the like. By adding the low-temperature solubilizer, the invention increases the low-temperature dissolubility of the main agent of the OSP, so that the OSP still has good stability when the temperature is reduced below 5 DEG C.

Description

technical field [0001] The invention relates to the technical field of organic solder preservatives for printed circuit boards (OSP), in particular to the research on the solution stability of organic solder preservatives at low temperatures. Background technique [0002] Organic Solderability Preservatives (OSP, Organic Solderability Preservatives) process is to form a layer of 0.2mm ~ 0.5mm hydrophobic organic protective film on the bare copper surface through chemical methods. This layer of film protects the copper surface from oxidation, is compatible with a variety of fluxes, and can withstand three thermal shocks above 260°C, which is beneficial to ensure the flatness of the solder joints and the warpage of the printed circuit board before assembly It has become the mainstream process to replace the hot air leveling process. [0003] The development of OSP started from the earliest first-generation benzotriazole (BTA) water-soluble copper protection solution, which fo...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/36H05K3/00
Inventor 肖忠良吴道新史燕许国军
Owner CHANGSHA UNIVERSITY OF SCIENCE AND TECHNOLOGY
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