Method of manufacturing semiconductor device
A manufacturing method and semiconductor technology, applied in the fields of semiconductor/solid-state device manufacturing, semiconductor devices, semiconductor/solid-state device components, etc., can solve problems such as difficulty in control, reduction in strength, and difficulty in maintaining quality
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[0024] figure 1 A cross-sectional view showing an example of a semiconductor device manufactured by the manufacturing method of the present invention. This semiconductor device is generally called a CSP, and includes a silicon substrate (semiconductor substrate) 1 . On the upper surface of the silicon substrate 1, elements constituting an integrated circuit with specified functions, such as elements (not shown) such as transistors, diodes, resistors, and capacitors (not shown), are formed. Connection pads 2 made of aluminum-based metal or the like on each element. Only two connection pads 2 are shown in the figure, but actually a plurality of connection pads 2 are arranged on the peripheral portion of the upper surface of the silicon substrate 1 .
[0025] A passivation film (insulating film) made of silicon oxide or the like is provided on the upper surface of the silicon substrate 1 except for the central portion of the connection pad 2, and the central portion of the conn...
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