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Method for preparing antioxidant soldering powder

An anti-oxidation and solder powder technology, applied in welding equipment, welding media, manufacturing tools, etc., can solve problems such as unstable solder paste viscosity, affecting solder paste quality and welding reliability, and prone to tin beads, etc., to reduce agglomeration Phenomenon, enhanced antioxidant performance, and cost-saving effects

Active Publication Date: 2010-06-23
BEIJING COMPO ADVANCED TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The oxygen content of solder powder has a crucial effect on the performance of solder paste. Solder powder with high oxygen content can cause the viscosity of solder paste to be unstable, and solder balls are prone to appear during soldering, resulting in leakage or short circuit between components, which seriously affects the solder paste. Paste quality and soldering reliability

Method used

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  • Method for preparing antioxidant soldering powder
  • Method for preparing antioxidant soldering powder

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0028] Coating solution ratio (wt%):

[0029] Malonic acid 2

[0030] Oleic acid 5

[0031] Sebacic acid 2

[0032] Nonylphenol polyoxyethylene ether OP-10 8

[0033] Diethylene glycol 20

[0034] N-Methylpyrrolidone Balance

[0035] The solder powder used is SnAgCu305 4# powder.

[0036] Heat 500g of the coating solution to 145-150°C, add 200g of solder powder, stir to suspend the solder powder in the coating solution, keep it for 20min, filter, and rinse with a 1:1 mixed solution of absolute ethanol and acetone to remove Excess coating solution on the surface of solder powder. Spread the solder powder over a large area, and dry it in vacuum at 40° C. for 1 hour to obtain coated solder powder.

Embodiment 2

[0038] Coating solution ratio (wt%):

[0039] Succinic acid 15

[0040] Glutaric acid 10

[0041] Benzotriazole 2

[0042] Diethylene glycol octyl ether balance

[0043]The solder powder used is SnAgCu305 5# powder.

[0044] Heat 500g of the coating solution to 145-150°C, add 200g of solder powder, stir to suspend the solder powder in the coating solution, keep it for 15min, filter, and rinse with a 1:1 mixed solution of absolute ethanol and acetone for several times to remove Excess coating solution on the surface of solder powder. Spread the solder powder over a large area, and dry it in vacuum at 40° C. for 1 hour to obtain coated solder powder.

Embodiment 3

[0046] Coating solution ratio (wt%):

[0047] Lactic acid 5.5

[0048] Glutaric acid 3

[0049] p-tert-Butylbenzoic acid 1

[0050] Fatty alcohol polyoxyethylene ether AEO-8 20

[0051] Diethylene glycol butyl ether balance

[0052] The solder powder used is SnBi58 3# powder.

[0053] Heat 500g of the coating solution to 103-108°C, add 500g of solder powder, stir to suspend the solder powder in the coating solution, keep it for 30min, filter, rinse with acetone several times to remove excess coating solution on the surface of the solder powder. Spread the solder powder over a large area, and dry it in vacuum at 40° C. for 1 hour to obtain coated solder powder.

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Abstract

The invention relates to a method for preparing antioxidant soldering powder, comprising the following steps: adding soldering powder to solution containing 5-25 percent by weight of active agent and 2-20 percent by weight of coating agent; stirring the active agent, the coating agent and the soldering powder at the temperature of 30-80 DEG lower than the soldering powder melting point so that the soldering powder suspending in the solution for 10-90 min; and filtering the solution, eluting the solution with solvent and drying the solution in vacuum to obtain the antioxidant soldering powder. The invention is suitable for coating the alloy soldering powder such as SnPb soldering powder, SnPbAg soldering powder, SnPbBi soldering powder, SnBi soldering powder, SnCu soldering powder, SnBiCu soldering powder, SnAg soldering powder, SnAgCu soldering powder and SnZn soldering powder of any particle size and is particularly suitable for coating the alloy soldering power of small particle size or the alloy soldering power which is easily oxidized. The soldering powder is coated by removing an oxidation layer on the surface of the soldering powder, thus the effect of coating the soldering power with the coating agent is improved, the shelf life of the soldering powder is prolonged, the requirements for the package, the storage and the transportation of the soldering powder are lowered, the cost is saved and the waste of the resources is reduced.

Description

technical field [0001] The invention relates to a preparation method of anti-oxidation solder powder, and relates to a coating technology of solder powder for solder paste. The prepared coated solder powder has better oxidation resistance and can improve the quality and stability of solder paste . Background technique [0002] Surface mount technology (SMT) is the main assembly method for the new generation of electronic equipment and electronic products. Solder paste is an important material for SMT technology, and its quality directly affects the quality and efficiency of SMT assembly. Solder powder accounts for about 90% of the mass of solder paste, and it mainly serves the purpose of forming solder joints in soldering to achieve soldering. The traditionally used solder powder particle size is 25-45μm (3#). With the development of miniaturization and light weight of electronic devices, people's requirements for the particle size of solder powder are getting smaller and s...

Claims

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Application Information

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IPC IPC(8): B22F1/02B23K35/22
Inventor 徐骏贺会军胡强赵朝辉张品
Owner BEIJING COMPO ADVANCED TECH
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