Magnetic control sputtering target

Abstract

The invention discloses a permanent-magnet magnetic control sputtering target with a round plane, which can sputter magnetic materials and is composed of an outer shield cover, a magnetic steel seat, a pole shoe, an insulating seat, a permanent seat, a target gland bush, inner magnetic steel, outer magnetic steel, a water inlet nozzle, a water outlet nozzle, an attachment bolt, a hermetical rubber, and the like, wherein a thread manual adjustable structure is adopted between the outer shield cover and the permanent seat, the materials of the magnetic steel seat are oxygen-free copper, the inner magnetic steel is arranged at the center of the magnetic steel seat, the periphery of the magnetic steel seat is drilled to form a plurality of pinholes for installing the outer magnetic steel, and target materials are directly laid on the magnetic steel seat and fixed by the target gland bush. The pole shoe is made of permeability materials, when the magnetic control target works, a direct current or radio-frequency power supply is applied to the pole shoe, the water inlet nozzle and the water outlet nozzle are welded by argon arc welding under the pole shoe, cooling water enters from a low place and outflows from a high place, and hermetical seal is realized by the hermetical rubber ring. The materials of the insulating seat are temperature-resistant insulating materials which can be used in vacuum, and are installed between the permanent seat (anode) and the pole shoe (cathode), and an insulating cap has the insulating action between an electriferous screw (cathode) and the permanent seat (anode). The invention has simple structure and low cost.

Description

technical field [0001] The invention relates to the field of coating equipment, in particular to a circular planar magnetron sputtering target capable of sputtering permanent magnets of magnetic materials. Background technique [0002] At present, in the field of domestic film preparation, magnetron sputtering is usually used as the mainstream of sputtering technology. The main reason is that magnetron sputtering has the characteristics of "high speed" and "low temperature". material film. The ordinary circular planar permanent magnet target technology capable of sputtering non-magnetic materials has been quite mature, and there are generally two types of magnetron targets capable of sputtering magnetic materials such as iron, nickel, and cobalt, one is an electromagnetic target, and the other is a magnetron target. One is a circular planar strong magnetic target modified from an ordinary circular planar permanent magnet target. [0003] However, electromagnetic targets ha...

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Problems solved by technology

[0004] 1. During the energization process, the magnetic field generated by the energized coil is not stable due to the influence of grid voltage, coil turns, coil material and human factors, and the quality of the film prepared under the same conditions is not necessarily the same;

[0005] 2. During the working process of the target, due to the limitation of the structure, the expected magnetic field requirements are often not met. If you want to increase the current to reach the expected magnetic field strength, you often burn out the electromagnetic coil;

[0006] 3. The cost of the electromagnetic target is also much higher than that of the permanent magnet target. In addition to a DC power supply, an excitation power supply is required, and the cost is about 1.5 times that of the permanent magnet target.

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