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Method for preparing gradient-structure copper radiating rib for electronic element

A gradient structure, copper heat sink technology, used in cooling/ventilation/heating transformation, wax adhesives, etc., can solve the problems of copper heat sinks not fully exerting heat absorption capacity, and the quality of copper heat sinks is limited in application, etc., to achieve high heat. Conductivity, improve heat dissipation efficiency, improve the effect of surface area

Active Publication Date: 2010-05-26
GRIMAT ENG INST CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The heat absorption capacity of pure copper is higher than that of aluminum, but the specific heat capacity of copper is 0.39J·Kg -1 ·K -1 , the specific heat capacity of aluminum is 0.9J Kg -1 ·K -1 , the aluminum heat sink with the same volume and shape has a stronger heat dissipation capacity than copper, and the copper heat sink prepared by the traditional process does not give full play to its heat absorption capacity.
(3) The density of copper is 8.9g cm -3 , the density of aluminum is 2.7g cm -3 , the higher quality of copper heat sinks limits its application in portable computers

Method used

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  • Method for preparing gradient-structure copper radiating rib for electronic element
  • Method for preparing gradient-structure copper radiating rib for electronic element
  • Method for preparing gradient-structure copper radiating rib for electronic element

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0034] A kind of preparation method of gradient structure copper radiator for electronic components, cylindrical fin radiator such as figure 1 shown in figure 1 The heat sink is shown as an example. The copper heat sink with gradient structure for electronic components includes the heat dissipation part 2 of the heat sink and the base 1 of the heat sink. The preparation process of the heat sink is as follows:

[0035] (1) The heat dissipation part 2 of the heat sink is prepared by metal powder injection molding technology,

[0036]①According to the volume ratio of copper powder and binder is 56%:44%, the copper powder and binder are fully mixed on the mixing extruder, and the copper powder is water atomized copper powder with a purity of 99.81%. Surface area is 0.077m 2 / g, bulk density is 3.4g / cm 3 , the density of the pycnometer is 8.86g / cm 3 , the particle size is about 10 μm, the SEM morphology of water atomized copper powder is as follows image 3 As shown, the binde...

Embodiment 2

[0045] A kind of preparation method of gradient structure copper radiator for electronic components, cylindrical fin radiator such as figure 1 shown in figure 1 The heat sink is shown as an example. The copper heat sink with gradient structure for electronic components includes the heat dissipation part 2 of the heat sink and the base 1 of the heat sink. The preparation process of the heat sink is as follows:

[0046] (1) The heat dissipation part 2 of the heat sink is prepared by metal powder injection molding technology,

[0047] ①According to the volume ratio of copper powder and binder is 62%:38%, the copper powder and binder are fully mixed on the mixing extruder, and the copper powder is water atomized copper powder with a purity of 99.81%. Surface area is 0.077m 2 / g, bulk density is 3.4g / cm 3 , the density of the pycnometer is 8.86g / cm 3 , the particle size is about 10 μm, the SEM morphology of water atomized copper powder is as follows image 3 As shown, the bind...

Embodiment 3

[0055] A kind of preparation method of gradient structure copper heat sink for electronic components, sheet fin heat sink such as figure 2 shown in figure 2 Take the heat sink shown as an example. The copper heat sink with gradient structure for electronic components includes the heat dissipation part 3 of the heat sink and the base 4 of the heat sink. The preparation process of the heat sink is as follows:

[0056] (1) The heat dissipation part 3 of the heat sink is prepared by metal powder injection molding technology,

[0057] ①According to the volume ratio of copper powder and binder is 70%:30%, the copper powder and binder are fully mixed on the mixing extruder, and the copper powder is water atomized copper powder with a purity of 99.81%. Surface area is 0.077m 2 / g, bulk density is 3.4g / cm 3 , the density of the pycnometer is 8.86g / cm 3 , the particle size is about 10 μm, the SEM morphology of water atomized copper powder is as follows image 3 As shown, the bind...

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Abstract

The invention discloses a method for preparing a gradient-structure copper radiating rib for electronic elements, and belongs to the technical field of powder metallurgy. The gradient-structure copper radiating rib for the electronic elements comprises a radiating part of the radiating rib and a base of the radiating rib, wherein the radiating part of the radiating rib is prepared by adopting the technology of metal powder injection molding, and the base of the radiating rib is prepared by adopting a machining method; the radiating part of the radiating rib and the base of the radiating rib are welded together to prepare the gradient-structure copper radiating rib for the electronic elements. The radiating part of the radiating rib prepared by adopting the method is made of a porous structure material of which the relative density is 50 to 96 percent, which is favorable for improving the superficial area and the radiating efficiency of the radiating rib obviously. The radiating efficiency of the gradient-structure copper radiating rib is 10 to 40 percent higher than that of a radiating rib of which the relative density is 99 percent, and the gradient-structure copper radiating rib fully embodies the high thermal conductivity of copper.

Description

technical field [0001] The invention belongs to the technical field of powder metallurgy, in particular to a method for preparing a gradient-structured copper heat sink for electronic components. Background technique [0002] Since the successful development and application of electronic devices, the research on its heat sink has also developed. In the early stage of the development of electronic devices, the power of electronic devices was low, and the heat sink was mostly made of aluminum or aluminum alloy, which was prepared by simple extrusion or cutting. With the development of technology, the power of electronic devices has increased, and the aluminum alloy heat sink with simple shape can no longer meet the heat dissipation requirements. At this time, there are two technical directions to improve heat dissipation efficiency: one is to increase the heat dissipation area of ​​aluminum alloy heat sinks, and to prepare heat sinks with complex shapes and larger surface are...

Claims

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Application Information

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IPC IPC(8): B23P15/26B22F1/00B22F3/115B22F3/24B22F3/10C09J191/08H05K7/20
Inventor 魏衍广林晨光陶海明罗峥
Owner GRIMAT ENG INST CO LTD
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