Silicon slice positioning and loading device of chemical mechanical polishing equipment

A technology of chemical machinery and silicon wafers, applied in the direction of grinding/polishing equipment, grinding equipment, metal processing equipment, etc., to achieve the effect of improving processing quality and efficiency

Inactive Publication Date: 2010-05-12
THE 45TH RES INST OF CETC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The increase in the processing volume of silicon wafers caused by changes in the size of silicon wafers and chips, as well as the requirements for silicon wafer processing accuracy, surface roughness, surface defects, surface cleanliness, and silicon wafer strength, pose new challenges to silicon wafer processing equipment

Method used

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  • Silicon slice positioning and loading device of chemical mechanical polishing equipment
  • Silicon slice positioning and loading device of chemical mechanical polishing equipment
  • Silicon slice positioning and loading device of chemical mechanical polishing equipment

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Experimental program
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Embodiment Construction

[0019] see Figure 1 ~ Figure 4 , the silicon wafer chemical mechanical polishing equipment positioning chip loading device has a loading chassis 104, a loading guide ring 101 is fixed on the loading chassis 104, and a first beveled chamfer 109 and a second beveled chamfer 110 are arranged in the loading guide ring 101; The loading chassis 104 is also provided with a water pressure nozzle, and there is a gap between the water pressure nozzle and the silicon chip 301 that can be mounted on the first chamfer 109. The water pressure nozzle has a central nozzle 105 and a peripheral nozzle 102. The structure of the central nozzle 105 It is: a central water pipe shaft 201 is provided, the outer surface of the central water pipe shaft 201 cooperates with the sealing sleeve 202, the sealing sleeve 202 is fixed on the loading chassis 104, the central through hole 205 of the central water pipe shaft 201 passes through the bottom gap and the first water pipe channel 107 connected, and is...

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Abstract

The invention provides a silicon slice positioning and loading device of chemical mechanical polishing equipment, which relates to the technical field of the chemical mechanical polishing equipment. The silicon slice positioning and loading device comprises a loading base plate, wherein a loading guide ring is fixed on the loading base plate and is internally provided with a first incline chamfer and a second incline chamfer; and a water pressure nozzle is arranged on the loading base plate, and a gap is arranged between the water pressure nozzle and a silicon slice arranged on the second incline chamfer. By adopting the device, the silicon slice can be precisely positioned, smoothly loaded and unloaded so as to be convenient for normally polishing; meanwhile, the silicon slice can not be scraped in the whole process, thereby being beneficial to improving the processing quality and the processing efficiency of the silicon slice.

Description

technical field [0001] The invention relates to the technical field of chemical mechanical polishing equipment. Background technique [0002] The integrated circuit (IC) is the core of the electronic information industry, and the chemical mechanical polishing (CMP, Chemical Mechanical Polishing) equipment used for IC manufacturing is one of the key equipment in the semiconductor integrated circuit manufacturing. CMP technology is considered to be the best process method that can take into account the surface roughness and surface planarization requirements of silicon wafers and obtain a non-damaged surface. It is generally believed that global planarization is necessary for devices with a minimum feature size of 0.35 μm and below, and chemical mechanical polishing is currently the only process technology that can provide comprehensive planarization on the entire silicon wafer. To reduce the cost of unit manufacturing, the diameter of silicon wafers is required to continue t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24B37/04B24B41/00H01L21/302B24B37/27
Inventor 高文泉廖垂鑫陈威李伟王伟柳滨
Owner THE 45TH RES INST OF CETC
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