Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Method for processing acidic etching waste solution of printed circuit board

A technology for acid etching waste liquid and printed circuit board, which is applied in the field of acid etching waste liquid treatment, can solve the problems of waste of resources, low copper extraction efficiency, pollution, etc., so as to save resources, improve copper extraction efficiency, and avoid environmental pollution. Effect

Active Publication Date: 2010-04-14
SHENZHEN JECH TECH
View PDF2 Cites 24 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] The purpose of the embodiments of the present invention is to provide a treatment method for acidic etching waste liquid of printed circuit boards, which aims to solve the problems of low copper extraction efficiency, incomplete recovery of waste liquid, waste of resources and environmental pollution in existing treatment methods

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Method for processing acidic etching waste solution of printed circuit board
  • Method for processing acidic etching waste solution of printed circuit board
  • Method for processing acidic etching waste solution of printed circuit board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0037] Take 100ml acidic etching waste solution (the acidic etching solution system is "hydrochloric acid + sodium chlorate" system), and the relevant parameters are Cu 2+ =143.6g / L, Cl - =225.7g / L, the acid equivalent is 1.28N, neutralize it with 25% ammonia water, adjust the pH to be 8 (±0.2), the adjusted solution volume is 196ml, Cu 2+ =73.2g / L, Cl - =92.3g / L, pH value=8.01. Carry out extraction with oxime extractant, di-tert-butylmethylphenol or methylphenol are antioxidant, wherein, oxime content is 98wt%, antioxidant content is 2wt%, volume ratio (V / V) 25%, oil-liquid ratio ( After O / A) 2 / 1 carries out three extractions, raffinate is clear and transparent (copper ion concentration is below 0.5g / L). Then the raffinate is adjusted to a pH value of 6.5 to 7.0, and the solid content in the raffinate is analyzed to be 30g. The extract is placed in a distiller for negative pressure distillation, and the pressure is set to make it boil at 75 to 85°C. When the solution was ...

Embodiment 2

[0041] The implementation conditions are basically the same as in Example 1, except that the acidic etching solution is firstly pretreated by pressurized distillation, and then distilled under reduced pressure at 75°C to 85°C. The volume of the distilled liquid is 60ml, the acid equivalent is 1.1mol / L, and the remaining The solution is 40ml, neutralized with 25% ammonia water, and the pH is adjusted to be 8 (±0.2), and the adjusted solution volume is 96ml, Cu 2+ =149.6g / L, Cl - =235g / L, pH value=8.01. Carry out extraction with oxime extractant, di-tert-butylmethylphenol or methylphenol are antioxidant, wherein, oxime content is 98wt%, antioxidant content is 2wt%, volume ratio (V / V) 30%, oil-liquid ratio ( After O / A) 3 / 1 carried out four extractions, the raffinate was clear and transparent (copper ion concentration is below 0.5g / L).

Embodiment 3

[0043] The implementation conditions are basically the same as in Example 1, the difference is: extract with β-diketone extractant, without adding antioxidant, volume ratio (V / V) 30%, oil-liquid ratio (O / A) 2 / 1 After carrying out three extractions, the raffinate is clear and transparent (copper ion concentration is below 0.5g / L).

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention provides a method for processing acidic etching waste solution of a printed circuit board, wherein the acidic etching waste solution comprises hydrochloric acid and copper chloride. The method comprises the following steps: adding ammoniac regulation solution in the acidic etching waste solution for converting the acidic etching waste solution into an ammoniac etching solution system with the pH value above 7.5, and then carrying out copper extraction. The processing method improves the copper extraction efficiency and ensures that the recovery rate of metallic copper can reach above 99.3 percent; the raffinate is processed to obtain ammonium chloride which can be directly reused for an etching process according to requirements, and the recovery rate of the ammonium chloride can reach above 99.9 percent, thereby not only saving resources, but also avoiding the environment pollution, and really achieving recycling economy and clean production.

Description

technical field [0001] The invention belongs to an acid etching waste liquid treatment method, in particular to a printed circuit board acid etching waste liquid treatment method. Background technique [0002] There are two types of etching solutions for printed circuit boards: acidic and alkaline, and the etching of single-sided and multi-layer boards is mainly acidic. At present, the commonly used acidic etching solution systems include hydrochloric acid, hydrochloric acid + sodium chlorate, hydrochloric acid + hydrogen peroxide and other systems. During production, as the etching continues, the concentration of copper ions in the etching solution continues to increase. When the copper ions exceed a certain concentration After that, the etching ability will gradually decrease, and the etching solution will lose its etching ability and become etching waste liquid. The main components of acidic etching waste liquid generally include hydrochloric acid and copper chloride [if...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): C23F1/46
Inventor 李建光
Owner SHENZHEN JECH TECH
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products