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Electroplating device of copper plating of graphite powder and technique

An electroplating device and electroplating process technology, applied in the direction of electrolysis process, electrolysis components, etc., can solve the problems of unfavorable copper deposition, low deposition rate, low limit current, etc. Effect

Inactive Publication Date: 2010-03-10
GCI SCI & TECH +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, because conventional electroplating does not circulate the plating solution, it is not conducive to the graphite powder to contact the cathode surface, and it is not conducive to the deposition of copper on the graphite surface, and the limiting current is low, resulting in a low deposition rate, rough coating, and not dense

Method used

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  • Electroplating device of copper plating of graphite powder and technique

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0041] The base material is 200 mesh flake graphite, and the specific operation steps are as follows:

[0042] Graphite pretreatment

[0043] A: Use muffle furnace for degreasing at high temperature to degrease, temperature: 600°C, time: 30min;

[0044] B: Ultrasonic roughening with concentrated nitric acid ultrasonic roughening, temperature: room temperature, time: 20min;

[0045] C: Wash with distilled water until neutral;

[0046] flow copper plating

[0047] Plating solution preparation and operating conditions: copper sulfate 10g dm -3 , graphite powder 15g·dm -3 , concentrated sulfuric acid 5cm 3 · dm -3 , Glacial acetic acid 0.2cm 3 · dm -3 , formamide 0.3cm 3 · dm -3 , the number of plating tank combinations is 2; the temperature is 60°C; the flow rate of the plating solution is 12dm -3 min -1 ;Ultrasonic frequency 20kHz current density 30A·dm -2 ,; time 20min.

[0048] (3) Post-treatment of graphite powder copper plating

[0049] A: Copper-clad graphite...

Embodiment 2

[0053] Base-material is 200 order graphite flakes, and difference from embodiment 1 is:

[0054] flow copper plating

[0055] Plating solution preparation and operating conditions: copper sulfate 10g dm -3 , graphite powder 15g·dm -3 , sodium hypophosphite 5g·dm -3 , concentrated sulfuric acid 5cm 3 · dm -3 , Glacial acetic acid 0.2cm 3 · dm -3 , formamide 0.3cm 3 · dm -3 ; The number of plating tank combinations is 2; the temperature is 60°C; the flow rate of the plating solution is 12dm -3 min -1 ; Ultrasonic frequency 20kHz; Current density 30A·dm -2 ; Time 20min.

[0056] All the other steps are the same as in Example 1.

[0057] The copper clad graphite powder composite material prepared in this example has a mass fraction of copper of 60%, and the coating is dense and uniform.

Embodiment 3

[0059] Base-material is 200 order graphite flakes, and difference from embodiment 1 is:

[0060] flow copper plating

[0061] Plating solution preparation and operating conditions: copper sulfate 8g dm -3 , graphite powder 15g·dm -3 , sodium hypophosphite 10g·dm -3 , concentrated sulfuric acid 5cm 3 · dm -3 , Glacial acetic acid 0.2cm 3 · dm -3 , formamide 0.3cm 3 · dm -3 ; The number of plating tank combinations is 2; the temperature is 60°C; the flow rate of the plating solution is 12dm -3 min -1 ; Ultrasonic frequency 20kHz; Current density 30A·dm -2 ; Time 20min.

[0062] All the other steps are the same as in Example 1.

[0063] The copper-clad graphite powder composite material prepared in this example has a mass fraction of copper of 65%, and the coating is dense and uniform.

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Abstract

The invention discloses an electroplating device of copper plating of graphite powder and a technique. The reaction device comprises a special electroplating bath with the bottom part of being a cathode stainless steel plate, and carries out multi-group overlapping of 1 to 3 plating baths according to production needs, thus improving deposition efficiency and shortening deposition time. The bottompart of the cathode stainless steel plate is provided with an ultrasonic vibrating device, and leads metallic copper to be deposited on graphite particles so as to form a copper-coated graphite powder compound material. The electrolyte adopted by the flowing copper-coating technique is as follows: 8 to 12g.dm<-3> of CuSO4, 0 to 20g.dm<-3> of NaH2PO2.H2O, and little amount of surface active agent.The applied current density is 20 to 40A.dm<-2>, the reaction temperature is 60 DEG C, the loading amount of the graphite powder is 5 to 15g.dm<-3>, the flow speed of the plating solution is controlled into 8 to 12dm<-3>.min<-1>, and the electroplating time is 20 to 40min. The device for preparing the graphite powder material shortens the production period, the prepared copper-plated layer of thecopper-coated graphite powder is even and continuous and has the same thickness, the production efficiency is improved and the production cost is reduced. The device has simple structure, reasonabletechnique design and convenient operation.

Description

technical field [0001] The present invention relates to a production device and process of graphite powder copper plating, in particular to a process of using ultrasonic flow electroplating copper on flake graphite, the copper-coated graphite powder produced by this process can be used to manufacture high-performance brushes, high-speed Copper / graphite composite materials for train pantograph slides, small precision self-lubricating sliding bearings and other sliding electrical contact parts. Background technique [0002] With the development of modern science and technology, composite materials have been paid more and more attention. Coating copper on the surface of graphite is of great significance to improve the performance of graphite. Its comprehensive properties such as excellent wear resistance, low friction factor and low impedance greatly exceed the mechanical mixture of graphite powder and copper powder. Therefore, copper-clad graphite powder composite materials a...

Claims

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Application Information

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IPC IPC(8): C25D5/00C25D7/00C25D17/00C25D3/38B22F1/02
Inventor 余刚肖耀坤邹超
Owner GCI SCI & TECH
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