Improved semiconductor water cooling module for computer display card

Abstract

The invention relates to a semiconductor water cooling module for a computer display card, which can lower the temperature of a heating device to the temperature lower than ambient temperature, be suitable for various environmental occasions and achieve large application range and silence. The semiconductor water cooling module for a computer display card comprises a connecting element, a red copper plate, a display card and a display card chip and is characterized in that the connecting element is a lower embedding block; the lower embedding block is connected with the display card; one sideof a non-display card contact surface in the middle hollow position of the lower embedding block is provided with the red copper plate; one side of the red copper plate is in contact with the displaycard chip after protruding out of the hollow part of the lower embedding block, and the other side of the red copper plate is attached to the refrigerating surface of a semiconductor refrigerating sheet; the hot surface of the semiconductor refrigerating sheet is in contact with the plane of an exchanger, and the exchanger is provided with an external pipeline interface.

Description

(1) Technical field [0001] The invention relates to the technical field of cooling of computer graphics cards, in particular to a semiconductor water cooling module for computer graphics cards. (2) Background technology [0002] The current cooling of computer graphics cards generally adopts two methods of air cooling and water cooling. With the continuous development of graphics card processing chips, the heat generated during the work process continues to increase. In order to ensure good heat dissipation performance and normal operation of the graphics card, Its air cooling must be cooled by a high-speed fan, which brings loud noise and vibration, which is annoying. However, in the existing water-cooling mode, the cooling effect of the water-cooling module can only reduce the temperature to the ambient temperature at most, which is not suitable for applications where the ambient temperature is relatively high (especially in summer), so its applicable range is small. (3)...

AI Technical Summary

Problems solved by technology

[0002] The current cooling of computer graphics cards generally adopts two methods of air cooling and water cooling. With the continuous development of graphics card processing chips, the heat generated during the work process continues to increase. In order to ensure good heat dissipation performance and normal operation of the graphics card, Its air cooling must be cooled by a high-speed fan. The high-speed fan brings loud noise and vibration, which is annoying.

However, in the existing water cooling mode, the cooling effect of the water cooling module can only reduce the temperature to the ambient temperature at most, which is not suitable for applications where the ambient temperature is relatively high (especially in summer), so its scope of application is small

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