Power module for controlling leading out of terminal spring

A technology for controlling terminals and power modules, applied in electrical components, electrical solid devices, circuits, etc., can solve the problems of lead vibration, easy falling off and peeling of lead wires, heat transfer performance, large branch inductance, etc., to reduce electromagnetic interference, friendly User interface, the effect of reducing energy consumption

Inactive Publication Date: 2009-11-18
嘉兴斯达微电子有限公司
View PDF0 Cites 1 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The present invention aims to solve the problems of the existing power module (IGBT module) due to the connection of wire bonding with large partial inductance, uneven current distribution, vibration of lead wires, easy falling off of lead wires and poor heat transfer performance.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Power module for controlling leading out of terminal spring

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0009] The present invention will be further described in conjunction with the accompanying drawings and embodiments.

[0010] As shown in the figure, the present invention includes a housing 2 , an IGBT chip, a diode chip, an insulating substrate, a heat sink, power terminals and control terminals disposed in the housing 2 . The IGBT chip and the diode chip are reflow soldered to the insulating substrate (DBC), and the electrical connection between the chips is realized through aluminum wire bonding, and the control terminal is drawn out from the spring 1 .

[0011] In the present invention, when the chip group consisting of IGBT chips and diode chips inside the same IGBT module is more than one group, the control terminals of each chip are respectively led out by springs. The springs are secured with plastic clamps.

[0012] In the present invention, since the control terminal is led out by the spring, when the PCB board is installed above the module of the present inventio...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention discloses a power module for controlling leading-out of a terminal spring. The power module comprises a shell, an IGBT chip arranged in the shell, a diode chip, an insulating substrate, a radiating rib, a power terminal and a control terminal, wherein the IGBT chip and the diode chip are reflow welded onto the insulating substrate; the chips realize electronic connection through aluminum wires bonding; and the control terminal is led out by the spring. The power module can reduce energy consumption and noise interference of a gate electrode, conveniently realizes parallel connection of the chips and the module, and can reduce electromagnetic interference of a drive circuit. The power module is particularly applicable to a rigorous environment, such as traffics and locomotives.

Description

technical field [0001] The present invention relates to the field of power electronics, in particular to the field of power modules, in particular to a power module with a control terminal spring drawn out. technical background [0002] The power module (IGBT module) includes IGBT chip, diode chip, insulating substrate (DBC), heat dissipation copper plate, bonding aluminum wire, power terminal, control terminal, bracket and housing, etc. The insulating substrate (DBC) is located on the copper heat dissipation plate, On the DBC, there are IGBT chips and diode chips welded on it. Aluminum wire bonding is used between each chip and between the chip and DBC to realize electrical connection. The control terminals are led out of the module. [0003] The control terminals of traditional modules are connected by wire bonding, which is also the most widely used interconnection method in the field of power electronics. However, there are many defects in this wire bonding interconnec...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): H01L25/07H01L23/48H01L23/52
CPCH01L2924/0002
Inventor 刘志宏金晓行姚礼军胡少华张宏波雷鸣余传武沈华
Owner 嘉兴斯达微电子有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap