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Welding structure and method of target and backing plate

A welding method and welding structure technology, which is applied in welding equipment, non-electric welding equipment, metal material coating technology, etc., can solve the problems that the atoms on the metal contact surface cannot be effectively diffused, and the joint strength cannot meet the requirements, so as to achieve the bonding strength Effect of improving, improving efficiency, and preventing oxidation

Inactive Publication Date: 2009-09-23
KONFOONG MATERIALS INTERNATIONAL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

When the temperature rises, the surface of the titanium target and the aluminum back plate will quickly form an oxide layer in the air, and the atoms on the contact surface of the two metals cannot effectively diffuse, so that the joint strength of the two cannot meet the requirements.

Method used

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  • Welding structure and method of target and backing plate
  • Welding structure and method of target and backing plate
  • Welding structure and method of target and backing plate

Examples

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Embodiment Construction

[0013] figure 1 It is a flow chart of a specific embodiment for making the welding structure of the target and the back plate according to the present invention. Such as figure 1 As shown, step S101 is performed to provide a titanium target and an aluminum back plate;

[0014] The titanium target is high-purity titanium (4N5) or ceramic sputtered titanium (5N).

[0015] Execute step S102 to form grooves on the aluminum backplane;

[0016] The step of forming the groove may be: spin-coating a photoresist layer on the aluminum back plate; defining a groove pattern on the photoresist layer through a photolithography process; using the photoresist layer as a mask, Etch the aluminum backplate to form grooves with the same size as the titanium target.

[0017] Execute step S103 to install the titanium target into the groove;

[0018] Before putting the titanium target into the groove, it also includes: roughening the surface of the aluminum back plate; cleaning the titanium tar...

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Abstract

The invention relates to a welding structure and a method of a target and a backing plate, wherein the welding method of the target and the backing plate includes the steps of: providing a titanium target and an aluminum backing plate; forming a groove on the aluminum backing plate; mounting the titanium target in the groove; and adopting a hot isostatic pressing method to weld the titanium target and the aluminum backing plate. The invention greatly reduces the use amount of welding materials and simultaneously, the technology does not affect the tissue structure of the target and causes the quality of the target to meet the final use requirement.

Description

technical field [0001] The invention relates to the field of semiconductor manufacturing, in particular to a welding structure and method of a target material and a back plate. Background technique [0002] In the manufacture of large-scale integrated circuits, the target component is composed of a target that meets the sputtering performance and a back plate that is combined with the target and has a certain strength. The back plate can play a supporting role when the target assembly is assembled to the sputtering base station, and has the effect of conducting heat. [0003] At present, the process of welding the target material and the back plate usually adopts a hot isostatic pressing (HIP) diffusion welding process. The hot isostatic pressing process is a process method that uses uniform static pressure in all directions to press at high temperature. This method uses a metal or ceramic sheath (low carbon steel, Ni, Mo, glass, etc.), and uses nitrogen or argon as a pres...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K20/14B23K20/24C23C14/34
Inventor 姚力军潘杰王学泽毛立鼎刘庆
Owner KONFOONG MATERIALS INTERNATIONAL CO LTD
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