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Carbon nanometer material radiating module

A carbon nanomaterial, heat dissipation module technology, applied in instruments, electrical digital data processing, digital data processing components and other directions, can solve the problems of high price, poor thermal conductivity, large quality of copper materials, etc. Production cost, improved heat dissipation efficiency, low expansion coefficient effect

Inactive Publication Date: 2009-09-02
深圳市东维丰电子科技股份有限公司
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Problems solved by technology

[0003] Traditional heat dissipation modules generally use aluminum or copper with relatively superior heat dissipation performance as heat dissipation materials. Among them, aluminum has relatively poor thermal conductivity, while copper has slightly better performance but higher quality, and the price is relatively much more expensive. Not only the heat transfer effect is not good, but also the cost of the heat dissipation module is increased, and its cost performance is not reasonable

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  • Carbon nanometer material radiating module
  • Carbon nanometer material radiating module
  • Carbon nanometer material radiating module

Examples

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Embodiment Construction

[0026] The following examples are further explanations and illustrations of the present invention, and do not constitute any limitation to the present invention.

[0027] refer to Figure 1 ~ Figure 4 , the carbon nanomaterial heat dissipation module of the present invention includes at least one heat transfer module 10, at least one heat pipe 20, heat dissipation fin assembly 30 and heat dissipation fan 40, in this example, the heat transfer module 10 includes three heat transfer modules 11, 12, 13, they are respectively in contact with the south bridge chip, north bridge chip and CPU of the notebook computer in three heating devices, and the three heat transfer modules are made of carbon nanomaterials. The carbon nanomaterial is formed by mixing a graphite powder base material with a weight percentage content of 50% to 99% and a high thermal conductivity nanomaterial with a weight percentage content of 1 to 50%. In this example, the graphite powder base material and The pre...

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Abstract

The invention relates to a carbon nanometer material radiating module for the [heat] radiation of heating elements of a notebook computer, comprising at least one heat transferring module (10) that is contacted with at least one heating element of the notebook computer and made of carbon nanometer materials, at least one thermotube (20), a radiating fin component (30) that is made of carbon nanometer materials and arranged at the condensation end of the thermotube (20) and a radiating fan (40) arranged opposite to the radiating fin component (30). The thermotube (20) is tightly combined with the heat transferring module (10) and the radiating fin component (30) respectively, and the radiating fin component (30) is arranged at the air outlet of the radiating fan (40). The carbon nanometer material radiating module has the characteristics of easy acquisition of materials, low production cost, light weight, corrosion resistance and high radiating efficiency, and the like.

Description

【Technical field】 [0001] The invention relates to a heat dissipation device for heat dissipation of an electronic heating element, in particular to a low-cost, light-weight and corrosion-resistant carbon nanometer material heat dissipation module for heat dissipation of a notebook computer heating element. 【Background technique】 [0002] At present, the problem of heat dissipation has become one of the important bottlenecks restricting the development of electronic components. The traditional heat dissipation method usually uses a heat dissipation module attached to the heating element to dissipate heat from the electronic components. Ordinary heat dissipation modules usually consist of a heat pipe, a centrifugal fan, a number of heat dissipation fins, and a metal block located at the lower part of the heat pipe for heat transfer between the element and the heat pipe. Among them, the heat transfer metal block and heat dissipation fins are generally made of aluminum or coppe...

Claims

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Application Information

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IPC IPC(8): G06F1/20
Inventor 黄晓东陈海波
Owner 深圳市东维丰电子科技股份有限公司
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