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Hot melt pressure sensitive adhesive composition that includes vegetable wax and articles including the same

A technology of pressure-sensitive adhesives and compositions, applied in the directions of adhesives, transportation and packaging, bandages, etc., which can solve the problem of weakened properties

Inactive Publication Date: 2009-08-26
HB FULLER CO
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

When such waxes are used to formulate hot melt adhesive compositions, this property tends to impair the ability of the composition to maintain surface adhesion to a substrate when exposed to elevated temperatures for extended periods of time

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0073] Test procedure

[0074] The test procedures employed in the Examples include the following.

[0075] 180° peel force test method

[0076] The 180° peel force was measured as follows. By adding the sample composition at 25g / m 2 Samples were prepared by applying a coat weight of 1000 to Mylar polyester film. The Mylar film was then cut into 1 inch wide by 8 inch long strips. 5 inches of the adhesive-coated side of the test sample was applied to a stainless steel test panel without applying pressure. A 5 pound rubber coated roller was passed through the sample once in each machine direction at a rate of approximately 12 inches per minute, ensuring that the sample was free of trapped air pockets.

[0077] Fold the free end of the sample itself in half at an angle of 180°, clamp it in the dynamometer of the tensile testing machine, and fix the stainless steel plate on the slide plate of the testing machine. The film was then peeled off at a constant rate of 12 + / - 1 in...

Embodiment 1

[0095] A hot melt pressure sensitive adhesive composition was prepared as follows. Add about 29.4 parts WINGTACK 86 tackifying resin and 19.3 parts SYLVAREZ ZT5100 tackifying resin (Arizona Chemical, Savannah, Georgia) and 0.3 parts IRGANOX 1010 antioxidant to a Σ paddle mixer with a nitrogen atmosphere and heated to a temperature of 350°F agent (Ciba Chemicals, New York). Operate the mixer until the antioxidant is fully blended with the molten tackifying resin. VECTOR 4211 styrene-isoprene-styrene block copolymer (Dexco, Huston, Texas) was added to the tackifying resin. After the copolymer was fully added to the resin and a homogeneous melt was formed, 14.7 parts of hydrogenated soybean oil wax VEGETABLE WAX 866970 (ADM, Decatur, Illinois) with melting points of 64.73°C and 55.8°C, and 19.6 parts of NYFLEX 222B oil (Nynex Corporation, Sweden) was added to the melt. The Σ paddle mixer was operated until the contents formed a smooth molten blend, and the material was removed...

Embodiment 2

[0099] The hot melt pressure sensitive adhesive composition of Example 2 was prepared according to the procedure of Example 1, except that the components present in the composition and their amounts were as follows: 48.7% by weight ESCOREZ 5690 tackifying resin (ExxonMobil, Houston, Texas) , 20.6% by weight NYFLEX 222B viscosity modifier, 13.7% by weight VECTOR 6241 styrene-butadiene-styrene block copolymer (ExxonMobil), 14.7% VEGETABLE WAX 866970 hydrogenated soybean oil wax, and 0.3% IRGANOX 1010 antioxidant agent. A differential scanning calorimetry scan of the hot melt pressure sensitive adhesive composition of Example 2 is shown in FIG. 3 . At 48.425°C and 2.965×10 4 dyn / cm 2 The G’ / G” intersection appears below. The vertical axis on the right is dyn / cm 2 , the vertical axis on the left is tanδ, and the horizontal axis is in °C.

[0100] The expected results are given in Table 1 when Controls 1 and 2 and Examples 1 and 2 were tested according to the viscosity, 180° pe...

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PUM

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Abstract

The invention provides a hot melt pressure-sensitive adhesive composition that includes thermoplastic polymer, tackifying agent, plasticizer oil, and from at least 5 % by weight to about 25 % by weight vegetable wax.

Description

[0001] Cross References to Related Applications [0002] This application claims the benefit of US Provisional Application 60 / 847,786, filed September 27, 2006, which is incorporated herein. Background of the invention [0003] Hot melt adhesive compositions are used in a variety of applications requiring the bonding of two substrates together, such as packaging applications (such as corrugated and cardboard), bookbinding, and shoemaking. Hot melt adhesive compositions are typically applied in the molten state and form a bond as it cools and solidifies. The time required for a hot melt adhesive to cool to a point strong enough to form a bond is referred to as the "set rate". The rate of solidification is an important parameter in applications requiring high speed processing operations such as packaging and bookbinding operations. For many packaging applications, the bond needs to be formed quickly, or the resulting package will be poorly or even unsealed. [0004] Waxes su...

Claims

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Application Information

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IPC IPC(8): C09J153/02C09J123/04
CPCA61F2013/00748C09J123/0815C08L2666/02Y10T428/1352Y10T428/31895Y10T428/31902
Inventor S·U·阿哈迈德S·R·沃恩V·罗加切夫斯基B·M·艾池勒-约翰逊
Owner HB FULLER CO
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