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Light emitting diode and preparation method thereof

A technology of light-emitting diodes and manufacturing methods, applied in semiconductor/solid-state device manufacturing, electrical components, electric solid-state devices, etc., can solve the problem of separation of circuit boards and heat-conducting seats, and achieve effective fixation

Inactive Publication Date: 2009-06-03
林志泽
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  • Abstract
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  • Application Information

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Problems solved by technology

[0005] However, the method for combining the above-mentioned circuit board with the heat conduction base is usually coated with a heat-resistant glue between the two, but because the thermal expansion coefficient of the heat-resistant glue is very different from that of the circuit board or heat conduction base , so it is easy to separate the circuit board from the heat conduction seat due to heat during the operation of the LED

Method used

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  • Light emitting diode and preparation method thereof
  • Light emitting diode and preparation method thereof
  • Light emitting diode and preparation method thereof

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Embodiment Construction

[0026] refer to figure 1 , according to the flowchart of the light-emitting diode manufacturing method of the present invention, the manufacturing method includes the following steps:

[0027] First, as in step 100, refer to figure 2 , providing circuit board 2 and heat conduction seat 3 .

[0028] The circuit board 2 includes an insulating plate 20, a metal layer 21 disposed on the lower surface of the insulating plate 20, two electrode layers 22 spaced apart on the upper surface of the insulating plate 20, and the following metal layers penetrating through the upper and lower surfaces of the circuit board 2. The through hole 23 of the LED chip is exposed. The circuit board 2 can be a single-layer printed circuit board with double-sided copper foil, and these electrode layers 22 are made by performing processes such as photoresisting, exposure, development, etching, and photoresist removal on one of the copper foils. , and the printed circuit board is cut and drilled in a...

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Abstract

The invention provides a light emitting diode and a preparation method thereof. A circuit board and a heat conducting seat are provided. The circuit board comprises an insulating plate, a metal layer arranged on the lower surface of the insulating plate, at least one electrode layer arranged on the upper surface of the insulating plate and a through hole passing through the circuit board. The metal layer of the circuit board or the heat conducting seat is provided with solder, and the circuit board and the metal layer thereof are welded on the heat conducting seat; and a light emitting diode chip is arranged on the heat conducting seat through the through hole of the circuit board, and the light emitting diode chip is electrically connected to the electrode layer of the circuit board by a metal wire. By taking advantage of the fact that the heat expansion coefficient of the solder is similar to the heat expansion coefficients of the circuit board and the heat conducting seat and that the solder is not easily worsened to lose adhesion effect, the circuit board and the heat conducting seat can be effectively fixed.

Description

technical field [0001] The invention provides a light emitting diode and a manufacturing method thereof. Background technique [0002] Light emitting diodes (LEDs) have the advantages of fast response, long life, small size, and light weight, and have been widely used as light sources in various indicators or display devices. Recently, with the rapid development of white light-emitting diodes, the application in lighting has gradually attracted attention. [0003] As the luminous power of light-emitting diodes for lighting increases, the heat generated by them also increases. However, if the heat dissipation effect of the packaging structure of the LED is not good, not only the luminous efficiency of the LED will be easily reduced, but also the lifetime of the LED will be seriously affected. [0004] For example, in the light-emitting diode disclosed in Taiwan Patent No. 488,557, the light-emitting diode chip is placed in the groove of the heat-conducting seat, and the cir...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/00H01L21/50H01L21/60H01L23/36H01L23/488H01L23/498H01L33/62
CPCH01L2924/01078H01L2224/48091
Inventor 林志泽
Owner 林志泽
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