Multi-chip common power supply/grounding structure for printed circuit board

Abstract

The invention discloses a multi-chip sharing power supply or ground structure used in a printed circuit board, which belongs to the technical field of circuit board noise suppression. The power supply or ground structure is a typical capacitor structure of which certain three layers are in metal-medium-metal structure and constructed in the multi-layer printed circuit board, wherein the used medium is a high dielectric constant medium; large area of power supply or ground metal plane is divided into areas with the same number according to the required power supplied chip number respectively, and each area is positioned under the chip supplied with power. Through embedding technology, namely the whole power supply / ground structure is a part of the circuit board, the structure has short wiring and small parasitic parameter, can work at high frequency, and greatly widens the high frequency property of a wave filter.

Description

technical field [0001] The invention relates to the technical field of circuit board noise suppression, in particular to a shared power supply / grounding structure for multiple chips in a printed circuit board. Background technique [0002] With the development of people's requirements for electronic products in the direction of miniaturization, multi-function and environmental protection, people strive to make electronic systems smaller, more integrated, and more powerful. Based on people's ideas like this, many new technologies, new materials and new designs have been born, such as system-in-chip and system-in-package technologies. In these technologies, it is often necessary to place multiple chips in a small area, and it is required to share a power supply network and a ground network. The working status of each chip is different, such as digital circuits, analog circuits or highly sensitive RF front-ends, which makes the common power network or common ground network pro...

AI Technical Summary

Problems solved by technology

There are many situations in which the segmented working mode is not allowed, because under the overall requirements of the system, each part of the working frequency band cannot be changed; what is more difficult is that even if the working frequency band is planned, it is unlikely that the secondary frequency band Or harmonics are planned at the same time, and secondary frequency bands or harmonics also cause harm to the system

If different chips are powered and grounded separately, and the decoupling is placed in another location, the problem is that on the one hand, the decoupling efficiency will be affected by the distance, and on the other hand, the overall system may not shrink

But the biggest disadvantage of the EBG structure is that a small change in the structure will have a great impact on the isolation performance, from the isolation frequency to the isolation depth

Therefore, the design of EBG is very complicated. Considering the complexity of the actual circuit board, it is necessary to analyze and design the overall power supply and grounding network while designing all the units individually.

In addition, if many uncertain factors in the processing technology are considered, such as material inconsistency, then process errors will greatly reduce the practicability of this technology

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