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Multi-layer mixed pressing printed circuit board and manufacturing method, apparatus thereof

A technology for printed circuit boards and manufacturing methods, applied in multilayer circuit manufacturing, printed circuit manufacturing, printed circuits, etc., can solve problems such as high cost, and achieve the effects of improving quality, reducing cost, and good high-frequency performance

Inactive Publication Date: 2009-05-06
ZTE CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

figure 1 This is the side view of this kind of mixed-pressed board. Generally, in this multi-layer board structure, the bottom layer is made of ordinary boards (such as FR-4 boards), and the top layer is made of boards with better high-frequency performance (such as Rogers boards). The advantage of pressing the board is that it has better high-frequency performance, but because the entire top layer is made of board with better high-frequency performance, there are also disadvantages: the cost is still high

Method used

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  • Multi-layer mixed pressing printed circuit board and manufacturing method, apparatus thereof
  • Multi-layer mixed pressing printed circuit board and manufacturing method, apparatus thereof
  • Multi-layer mixed pressing printed circuit board and manufacturing method, apparatus thereof

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Embodiment Construction

[0034] Generally speaking, the radio frequency part on the printed circuit board only needs to use a small part, or the place where the board material is more strict is very small, so the inventor considers only partially stacking, Mixed pressure to form a multi-media laminated printed circuit board structure that can achieve good high-frequency characteristics and reduce costs.

[0035] The multilayer mixed-voltage printed circuit board in the embodiment of the present invention includes:

[0036] At least one layer on the top, wherein each layer is formed by splicing at least one board of the first type of board and at least one of the second type of board;

[0037] The other layers below the top are made of at least one panel from the first type of panel;

[0038] The layers on the top and below the top are joined together in a laminated and mixed pressure manner.

[0039] In one embodiment, the top layer may have only one layer, that is, in a multilayer printed circuit b...

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Abstract

The present invention discloses a multi-layer mixed-compression printed circuit board which comprises at least one layer on the top, wherein each layer is respectively formed by the splicing of at least one board in the first series of board and at least one board in the second series of board. The multi-layer mixed-compression printed circuit board also comprises other layers under the top, wherein the other layers are composed of at least one board in the first series of board. The top layer and other layers under top are combined through the modes of laminating and mixed compression. The invention simultaneously discloses a manufacturing method and a manufacturing device of the multi-layer mixed-compression printed circuit board. A mixed-compression circuit board different from the prior art can be provided according to the invention for obtaining an effect of mixed-compression of board.

Description

technical field [0001] The invention relates to the field of printed circuit board manufacturing, in particular to a multilayer mixed-voltage printed circuit board and a manufacturing method and device thereof. Background technique [0002] In the prior art, a type of printed circuit board (Printed Circuit Board, PCB) commonly used in radio frequency adopts ordinary boards, such as FR-4 boards. The advantage of this type of board is that the cost is relatively low, and the disadvantage is that the high frequency characteristics are relatively poor. It can be used around 3GHz. The plates used in higher frequency bands or power amplifiers need to use a type of plate with better high-frequency performance, such as Rogers (Rogres) plate. The advantage of this type of plate is that it has better high-frequency characteristics and less loss. The disadvantage is that The cost is relatively high. [0003] With the development of communication technology, people have increasingly s...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/02H05K3/00H05K3/46
CPCH05K2201/09972H05K1/0366H05K2201/0187H05K3/4694H05K1/0306H05K3/4688
Inventor 唐瑞波
Owner ZTE CORP
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