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Packaging technique for solid electrolyte capacitor

A technology of solid electrolysis and capacitors, which is applied in the direction of solid electrolytic capacitors, capacitor shells/packages, capacitor parts, etc., can solve the problems of dielectric film defects on the surface of the anode body, increased leakage current of capacitors, and large mechanical damage. Leakage current pass rate, quality assurance, and effects of avoiding mechanical damage

Active Publication Date: 2009-04-15
福建国光新业科技股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, when encapsulating with solid resin, the pressure of the injection molding process is very high, and the mechanical damage to the laminated solid aluminum electrolytic capacitor is extremely great, and it is easy to cause defects in the dielectric film on the surface of the anode body, resulting in permanent defects that cannot be repaired by post-processing. damage, which is the main cause of increased leakage current or short circuit of the capacitor

Method used

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  • Packaging technique for solid electrolyte capacitor
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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0017] The 13V aluminum foil with the energizing voltage is cut and welded to the iron craft bar. After processing and forming the cutting edge, the solid electrolyte layer composed of polypyrrole, the cathode lead-out layer composed of carbon layer and silver layer are sequentially produced. Get the capacitor core. Then, a plurality of chips are placed on the lead frame by welding and bonding. Finally, place them in the cavity of an injection molding mold at 125°C, inject a liquid resin with a viscosity of 20,000mpa·s and a curing hardness of 100shoreD at 0.3MPa for 10 seconds, and keep it for 60 seconds to cure it into a package shell. into 6.3V solid aluminum electrolytic capacitors, followed by aging screening. The viscosity of liquid resin is relatively high at normal temperature, but the viscosity drops sharply at high temperature, so there is no problem in the formation of low-pressure injection.

Embodiment 2

[0019] During the injection molding, place it in the cavity of an injection molding mold at 150°C, inject a liquid resin with a viscosity of 45000mpa·s and a curing hardness of 120shoreD at 0.5MPa for 5 seconds, and keep it for 180 seconds to cure it into a package The shell is made into a 6.3V solid aluminum electrolytic capacitor, and the others are the same as in Embodiment 1

Embodiment 3

[0021] During the injection molding, place it in the cavity of an injection molding mold at 180°C, inject a liquid resin with a viscosity of 45,000mpa·s and a curing hardness of 120shoreD at 1MPa for 5 seconds, and keep it for 180 seconds to cure it into a package shell , make a 6.3V solid aluminum electrolytic capacitor, others are the same as in Example 1

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Abstract

The invention provides a packaging technology of a solid electrolytic capacitor; the packaging technology is as follows: the solid electrolytic capacitor with a well connected lead wire frame is placed in a forming mold cavity, liquid resin is injected in the forming mold cavity, the liquid resin is cured and formed in the cavity by maintaining a certain period of time after the injection, thereby forming the packaging resin and completing the packaging. The technology adopts the liquid resin during the packaging process of the electrolytic capacitor, the pressure needed for the injection molding process is small, the electrolytic capacitor has no mechanical injury, the pass rate of leakage current of the capacitor and the over-lead-free soldering-resistant thermal reliability are improved, the operation is simple, and the raw materials are easy to obtain, thereby being suitable for the large-scale technical development and promotion and having remarkable economic benefit.

Description

technical field [0001] The invention belongs to the field of solid electrolytic capacitor preparation, and more specifically relates to a solid electrolytic capacitor packaging technology. Background technique [0002] At present, the electrodes of chip-type solid aluminum electrolytic capacitors are made of aluminum foil. By sequentially forming a dielectric layer, a solid electrolyte layer (conductive polymer layer), and a cathode lead-out layer on the surface of high-purity aluminum foil, the anode lead-out end of the electrode is welded to the anode On the lead frame, the cathode lead-out layer is bonded on the cathode lead frame, and finally the capacitor formed is wrapped and sealed by the encapsulation resin shell. In the process of forming the resin shell, solid epoxy resin is generally used for plastic sealing, and the solid epoxy resin is heated to about 180°C to reach a molten state, and then a high pressure of about 100 atmospheres is applied to inject it into th...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01G9/08H01G9/15
Inventor 陈远强张易宁
Owner 福建国光新业科技股份有限公司
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