Lamination sheet type wave filter and method for producing the same

Abstract

The invention belongs to the technical field of electronic components and relates to a multi-layer chip filter and a preparation method thereof. The filter leads in ceramics and ferrite in the same chip and simultaneously realizes large inductance and large capacitance; wherein, the inductance consists of a hollow inductance (a 'magnetic core' is a ceramic material) and a magnetic core induction (the magnetic chip is ferrite material). The hollow inductance is characterized by small inductance value, large quality factor, high self-resonance frequency, and the like, thus being capable of better broadening the working frequency section of the filter; the magnetic core inductance has the characteristics of large inductance value, low self-resonance frequency, and the like, thus better reducing the in-band insertion loss of a filter with a low cut-off frequency and improving the effect of the transmission signal of the filter. The preparation method of the multi-layer chip filter includesthe steps such as material preparing, casting, punching, pore filling, conductor printing, chip overlapping, isostatic pressing, gumming, sintering, etc. The filter has the advantages of small size,large rectangle degree, large out-band rejection as well as broad working frequency. The preparation method has high controllability and can be compatible with the technique of the existing chip components.

Description

technical field [0001] The invention belongs to the technical field of electronic components, and in particular relates to a high-performance low-cutoff frequency laminated chip filter and a preparation method thereof. Background technique [0002] At present, when developing and producing small-sized low-cutoff frequency multilayer chip filters, two methods are mainly used: [0003] (1) Single component form. [0004] Pure inductance or pure capacitance type, this type of filter has the disadvantage of poor squareness; [0005] (2) LC structure form. [0006] Compared with the single-element form, the LC structure increases the number of elements to improve the filter's rectangularity and out-of-band suppression. In order to take into account the inductance and capacitance of the LC structure in a small-sized low-cut-off frequency multilayer chip filter , two ways are usually used: one is to use composite materials, which have the properties of dielectric ceramics and fe...

AI Technical Summary

Problems solved by technology

[0006] Compared with the single-element form, the LC structure increases the number of elements to improve the filter's rectangularity and out-of-band suppression. In order to take into account the inductance and capacitance of the LC structure in a small-sized low-cut-off frequency multilayer chip filter , two ways are usually used: one is to use composite materials, which have the properties of dielectric ceramics and ferrite materials, that is, have a large dielectric constant and a large magnetic permeability, and can realize large inductance at the same time and large capacitors, but at the same time increase the value of parasitic parameters, resulting in the narrow operating frequency range of the filter, poor out-of-band suppression performance and other shortcomings, the operating frequency can only be controlled within 1500MHz; another way is to develop inductors and capacitors separately, and then The inductor and capacitor chips are connected together by soldering. The filter obtained by this method has a large volume, a long production cycle, and a high cost.

Images