Substrate processing device and processing method thereof

Abstract

Dislosed is a substrate processing apparatus and a substrate processing method. After a substrate is cleaned, a liquid supply nozzle moves outward from above the center of the substrate while discharging a rinse liquid with the substrate rotated. In this case, a drying region where no rinse liquid exists expands on the substrate. When the liquid supply nozzle moves to above a peripheral portion of the substrate, the rotational speed of the substrate is reduced. The movement speed of the liquid supply nozzle is maintained as it is. Thereafter, the discharge of the rinse liquid is stopped while the liquid supply nozzle moves outward from the substrate. Thus, the drying region spreads over the whole substrate so that the substrate is dried.

Description

technical field [0001] The present invention relates to a substrate processing device and a substrate processing method for processing a substrate. Background technique [0002] Substrate processing equipment is used to perform various processes on various substrates such as semiconductor substrates, liquid crystal display substrates, plasma display substrates, optical disk substrates, magnetic disk substrates, magneto-optical disk substrates, and photomask substrates. [0003] In such a substrate processing apparatus, generally, a plurality of different processes are continuously performed on one substrate. The substrate processing apparatus described in Japanese Unexamined Patent Publication No. 2003-324139 includes an indexer block, an antireflection film processing block, a resist film processing block, a development processing block, and an interface block. An exposure device as an external device independent of the substrate processing device is disposed adjacent to t...

AI Technical Summary

Problems solved by technology

Therefore, in the substrate processing apparatus of the above-mentioned Japanese Unexamined Publication No. 2003-324139, when an exposure apparatus adopting the liquid immersion method described in the above-mentioned International Publication No. 99 / 49504 manual is installed as an external device, there is a possibility that the substrate processing apparatus of the above-mentioned Japanese Laid-Open No. 2003-324139 may adhere to The liquid on the substrate unloaded from the device falls into the substrate processing device, causing malfunctions such as abnormalities in the electrical system of the substrate processing device

[0008] In addition, if there is liquid attached to the substrate after the exposure treatment, dust and the like may easily adhere to the substrate, and the liquid attached to the substrate will form a The film on the substrate has a bad influence

Due to these reasons, there is a possibility of poor handling on the substrate

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