Adhesive composition, filmy adhesive, adhesive sheet, and semiconductor device made with the same
A technology of adhesives and compositions, applied in the direction of film/sheet adhesives, pressure-sensitive films/sheets, non-polymer organic compound adhesives, etc., can solve problems such as insufficiency, and achieve simplification of the pasting process, It has the effect of picking up and suppressing chip flying
Inactive Publication Date: 2009-02-11
RESONAC CORPORATION
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Problems solved by technology
However, it is a material that can ensure thermal fluidity that can be embedded in the wiring level difference on the substrate surface under the above-mentioned low temperature, low pressure, and short time conditions, and has both heat resistance at high temperatures including reflow resistance and its design is not enough
Method used
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[0201] Hereinafter, the present invention will be specifically described based on examples, but the present invention is not limited to these examples.
[0202] Synthesis of Polyimide Resin (PI)
[0203] (PI-1)
[0204] In a 300mL flask equipped with a thermometer, a stirrer, a condenser tube and a nitrogen inflow tube, 2.71 g (0.045 mol) of 1,12-diaminododecane, polyether diamine (D2000 (molecular weight: 1923)) 5.77g (0.01mol), 1,3-bis(3-aminopropyl)tetramethyldisiloxane (LP-7100 manufactured by Shin-Etsu Chemical Co., Ltd.) 3.35g (0.045mol) and N-methyl - 113 g of 2-pyrrolidone, and the reaction liquid was stirred. After 1,12-diaminododecane and polyetherdiamine are dissolved, cool the flask in an ice bath and add 4,4'-(4,4'-isosubstance, which has been refined by recrystallization with acetic anhydride in small amounts. Propyldiphenoxy)bis(phthalic dianhydride) 15.62 g (0.1 mol) (difference between endothermic start temperature and endothermic peak temperature measured ...
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Abstract
An adhesive composition which can reconcile, to a high degree, process characteristics including suitability for filling on an adherend (suitability for infiltration) and suitability for low-temperature laminating with semiconductor device reliability such as reflow resistance; and a filmy adhesive, an adhesive sheet having excellent process characteristics including easy strippability from dicing sheets, and a semiconductor device having excellent productivity, high adhesion strength at high temperatures, and excellent moisture resistance which each comprises or is produced with the adhesive composition. The adhesive composition comprises (A) a thermoplastic resin, (B) a bisallylnadimide represented by the following general formula (I), and (C) a (meth)acrylate compound having a functionality of 2 or higher. (Chemical formula 1) (I) In the formula, R1 is a divalent organic group comprising an aromatic ring and / or a linear, branched, or cyclic aliphatic hydrocarbon.
Description
technical field [0001] The present invention relates to an adhesive composition, a film-like adhesive, an adhesive sheet, and a semiconductor device using the same. Background technique [0002] Conventionally, a silver paste has been mainly used for joining a semiconductor element and a support member for mounting a semiconductor element. However, in recent years, along with the increase in size of semiconductor elements and the reduction in size and performance of semiconductor packages, support members used are also required to be smaller and more precise. In response to such requirements, the silver paste has gradually become unable to perform well due to extensive wettability, overflow or defects in wire bonding caused by tilting of the semiconductor element, difficulty in controlling the thickness of the silver paste, and voids in the silver paste. meet the above requirements. Therefore, in order to meet the above-mentioned requirements, film-like adhesives have been...
Claims
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IPC IPC(8): C09J4/02C09J4/06C09J7/00C09J7/02H01L21/301C09J7/22C09J7/38
CPCC09J4/06H01L2924/01025H01L2924/3511H01L24/32H01L2924/15311C08K5/3417H01L23/3128H01L21/6835H01L2224/48091H01L2924/01013H01L2224/32225H01L2224/85H01L2924/0665H01L2224/274H01L21/6836H01L2224/2919H01L2924/0104C09J2205/102H01L2224/8388H01L24/83H01L2924/01033H01L2924/01009H01L2224/32145H01L2924/01074H01L2924/01057H01L2224/83856H01L2924/01051C09J11/06H01L2924/01015H01L2924/01023H01L2924/01082H01L2221/68327H01L2924/01067H01L2224/83101H01L2924/09701H01L2924/01019H01L2924/01029H01L2924/01027C09J2479/08H01L2924/014H01L2924/01084H01L2224/83191H01L24/27H01L24/85C09J2423/006H01L2924/01047H01L2924/04953H01L2924/01079H01L21/67132H01L25/0657H01L2224/48227H01L2924/01005H01L24/29C09J7/0246H01L2924/01006H01L2225/0651H01L2924/0102H01L2924/10253H01L2221/6834H01L2924/01075H01L2924/01012H01L2224/73265H01L2924/07802H01L2924/15747H01L24/73H01L2924/181H01L2924/00014H01L24/48C09J7/38C09J7/22Y10T428/2896Y10T428/31721C09J2301/408H01L2924/00H01L2924/00012H01L2924/3512H01L2224/45015H01L2924/207H01L2224/45099C09J2203/326
Inventor 增子崇宫原正信大久保惠介
Owner RESONAC CORPORATION
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