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LED chip / wafer/ epitaxial slice non-contact type checking method and checking device

A technology of LED chips and detection methods, which is applied in the direction of measuring devices, semiconductor/solid-state device testing/measurement, photometry, etc., can solve problems such as damage, increased production costs, and difficulty in adoption, and achieve the effect of reducing costs

Inactive Publication Date: 2009-01-07
CHONGQING UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

For the detection of LED epitaxial wafers and chips, since the test probe must contact the chip when detecting electrical parameters, it is easy to cause pollution or even damage to the chip, and the test probe itself is a consumable part, which increases production costs, so it is difficult to test for LED. High-volume production process acceptance

Method used

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  • LED chip / wafer/ epitaxial slice non-contact type checking method and checking device
  • LED chip / wafer/ epitaxial slice non-contact type checking method and checking device
  • LED chip / wafer/ epitaxial slice non-contact type checking method and checking device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0074] See attached figure 1 , the detection device includes: a detection control and signal processing unit 1, a light source unit 2, a test bench 3, and a light detection unit 4, wherein the detection control and signal processing unit 1 controls the light source unit 2 to emit excitation light and transmits excitation light to the light detection unit 4 The incoming signal is processed and analyzed, the optical detection unit 4 collects the optical signal and transmits it to the detection control and signal processing unit 1 , and the test bench 3 is used to clamp / move the device under test 8 and support the optical detection unit 4 .

[0075] See attached figure 2 , wherein the detection control and signal processing unit 1 includes: a CPU, a result display unit, a light source excitation signal generation circuit, and a light source drive circuit, wherein the input end of the CPU is connected to the output end of the light detection unit 4 in communication, and the outpu...

Embodiment 2

[0080] See attached Figure 4 , the test bench 3 includes: platform 3-1, supporting device 3-2, guide rail 3-3, transmission device 3-4, clamping 3-5, stepper motor 1 3-6, wherein, guide rail 3-3, The clamp 3-5 is fixed on the platform 3-1, the clamp 3-5 is used to clamp the device 8 to be tested, the support device 3-2 is fixed on the transmission device 1 3-4 and is mechanically connected with the light detection unit 4, Stepping motor one 3-6 drives transmission device 3-4 to slide on guide rail 3-3.

[0081] Embodiment 2 is different from Embodiment 1 in that: in order to detect self-illumination from different directions, the light detection unit 4 is connected with the transmission device 1 3-4 through the supporting device 3-2, and is placed on the guide rail 3-3 to detect The control and signal analysis and processing unit 1 controls the stepper motor 3-6 to drive the transmission device 3-4 to move along the guide rail 3-3, so that the light detection unit 4 also mov...

Embodiment 3

[0084] see Figure 7, the test platform 3 is also fixedly connected with a scanning platform 5, and the scanning platform 5 is externally connected with a stepping motor 2 6 and a transmission device 2 7, wherein the stepping motor 2 6 drives the transmission device 2 7, and the transmission device 2 7 drives the scanning platform 5 Moving, the scanning table 5 drives the test table 3 to move, so that the position between the clamping 3-5 and the test table 3 can be relatively static or moving, which is used for the detection of the LED array on the LED wafer / epitaxial wafer.

[0085] This example differs from Embodiments 1 and 2 in that: the test platform 3 is fixed on the scanning platform 5, and the detection control and signal analysis and processing unit 1 controls the stepping motor 2 6 to drive the scanning platform 5 to move through the transmission device 2 7 to realize Scanning inspection of LED arrays on epitaxial wafers / wafers.

[0086] see Figure 8 , the signal...

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Abstract

The invention discloses a non-contact detection method of LED chip / wafer / epitaxial sheet, and a detection device thereof. The method comprises detecting the luminescent and electrical characteristics of the LED chip / wafer / epitaxial sheet, according to the photoluminescence of the detected device PN under the condition with the irradiation of controllable exciting light. The detection device comprises a detection control and signal processing unit which is used for processing and analyzing the signals transmitted by a light detecting unit, and a testing stand which is used for holding / moving the detected device and bearing the light detecting unit. The detection method has the beneficial effects of simultaneously realizing the non-contact and non-destructive testing of the luminescent and electrical characteristics of the LED chip / wafer / epitaxial sheet; the detection and screening of LED products is driven into the step of ''chip'' from the step of ''finished product'', which reduces the costs of the LED.

Description

technical field [0001] The invention relates to a detection technology of LED chip / wafer / epitaxial wafer parameters, in particular to a non-contact detection method and detection device for LED chip / wafer / epitaxial wafer. Background technique [0002] Semiconductor light-emitting device LED (Light Emitting Diode) is developing from a display device to the main lighting device of the next generation due to its long life, low energy consumption, no pollution, shock resistance, fast response, flexible application, and convenient control. With the continuous breakthrough of the key technology of LED, its luminous efficiency has been rapidly improved. The application field of using LED as a semiconductor lighting source continues to expand, and scientific researchers, engineers and technicians, and enterprise producers are working together to achieve the application of LED as a general lighting source in the shortest possible time. [0003] Due to the lack of suitable testing eq...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01M11/02G01R31/26G01J1/00H01L21/66
Inventor 文玉梅文静李平朱永李恋
Owner CHONGQING UNIV
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