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Photo-cured heat-cured resin composition and printed circuit board produced with the same

A resin composition, thermosetting technology, applied in printed circuit, printed circuit manufacturing, optics, etc., can solve the problems of residual residue, reduced resist developability, high reactivity, etc., to achieve excellent pattern accuracy and excellent developability , Excellent operability

Active Publication Date: 2008-12-10
TAIYO HLDG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the disclosed mercaptopropionic acid derivative has very high activity on the copper wiring present on the printed circuit board, and reacts with copper, so it is confirmed that residues remain even on the part that should be developed.
In addition, even in resist storage, the thiol group derived from mercaptopropionic acid used in these documents has high reactivity, and it was confirmed that it reacts with a compound having an unsaturated double bond, and the developability of the resist is significantly reduced.

Method used

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  • Photo-cured heat-cured resin composition and printed circuit board produced with the same
  • Photo-cured heat-cured resin composition and printed circuit board produced with the same
  • Photo-cured heat-cured resin composition and printed circuit board produced with the same

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Embodiment

[0118] Hereinafter, an Example and a comparative example are shown, and this invention is demonstrated concretely, However, Of ​​course, this invention is not limited to a following example.

Synthetic example 1

[0120] A cresol novolak type epoxy resin (manufactured by Nippon Kayaku Co., Ltd., EOCN-104S, softening point 92°C, epoxy group equivalent weight 220) 660g, carbitol acetate 421.3g, and solvent naphtha 180.6g, heated to 90°C, stirred, and dissolved. Next, after cooling to 60° C., 216 g of acrylic acid, 4.0 g of triphenylphosphine, and 1.3 g of methylhydroquinone were added and reacted at 100° C. for 12 hours to obtain a reaction product having an acid value of 0.2 mgKOH / g. 241.7 g of tetrahydrophthalic anhydride was added thereto, heated to 90° C., and reacted for 6 hours. Thus, a solution of carboxyl group-containing resin (A) having an acid value of 50 mgKOH / g, a double bond equivalent (g weight relative to 1 mole of unsaturated group resin) of 400, and a weight average molecular weight of 7000 was obtained. Hereinafter, the solution of this carboxyl group-containing resin is called A-1 varnish.

Synthetic example 2

[0122] Add o-cresol novolak type epoxy resin (epoxy group equivalent 215, 1 molecule has an average of 6 phenolic core) 430 g and acrylic acid 144 g (2 moles). It was heated to 120°C while stirring, and the reaction was continued for 10 hours while maintaining 120°C. Once the reaction product was cooled to room temperature, 190 g (1.9 moles) of succinic anhydride was added and heated to 80° C. for 4 hours. Again, the reaction product was cooled to room temperature. The acid value of the solid content of this product was 139 mgKOH / g.

[0123] To this solution, 85.2 g (0.6 mol) of glycidyl methacrylate and 45.9 g of propylene glycol methyl ether acetate were added, heated to 110°C while stirring, and the reaction was continued for 6 hours while maintaining 110°C. After cooling the reaction product to room temperature, a viscous solution was obtained. In this way, a solution of carboxyl group-containing resin (A) with 65% by mass of nonvolatile matter and 86 mgKOH / g of solid ...

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Abstract

A light-curing thermo-curing resin composition and a printed circuit board obtained using the same are provided, the composition has high light sensitivity and excellent curing depth in ultraviolet ray and laser exposure, thus further having great developing ability to pass through diluted alkaline aqueous solution while being excellent in storage stability and operability, so the composition is suitable for solder resisting agent. The light-curing thermo-curing resin composition comprises (A) carboxyl-containing resin, (B) mercaptobutyric acid or derivatives thereof, (C) photopolymerization initiator, (D) compounds having 2 or more of olefinic unsaturated groups in the molecules, and (E) thermo-curing components. The suitable (A) carboxyl-containing resin is preferably the carboxyl-containing resin capable of free radical polymerization and having unsaturated double bond. In addition, the (C) photopolymerization initiator is preferably oximes photopolymerization initiator (C1), particularly preferably proxetil photopolymerization initiator, aminoacetophenone photopolymerization initiator and / or acyl phosphine oxide photopolymerization initiator.

Description

technical field [0001] The present invention relates to a photocurable / thermosetting resin composition developable with a dilute alkaline aqueous solution, a cured product thereof, and a printed wiring board having a resist pattern obtained by using the same. Background technique [0002] Recently, in the exposure of the solder resist for printed wiring boards, laser scanning exposure has become widespread from the viewpoint of excellent alignment accuracy. [0003] Laser exposure forms an image while scanning the solder resist on a patterned wiring board without using a photomask. Therefore, in the case of using an existing commercially available solder resist, the appropriate exposure amount is 200mJ / cm 2 The above, therefore, has a disadvantage that exposure takes a lot of time. Therefore, very high sensitivity is required for the solder resist corresponding to laser exposure. [0004] From the viewpoints described above, oxime-based photopolymerization initiators capab...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/028G03F7/00H05K3/00
Inventor 伊藤信人有马圣夫
Owner TAIYO HLDG CO LTD
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