Brush head for cleaning silicon chip

A chip and silicon chip technology, applied in the field of chip brush that can improve the efficiency of chip brushing, can solve the problems of silicon chip surface scratches, low particle cleaning efficiency, secondary contamination, etc., to improve particle removal rate and reduce secondary contamination. Less contamination and less scratches

Active Publication Date: 2010-05-19
SHANGHAI HUAHONG GRACE SEMICON MFG CORP
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  • Summary
  • Abstract
  • Description
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Problems solved by technology

Moreover, because the movement of the silicon wafer and the brush is relatively slow, there is no reciprocating movement (only horizontal movement) for a relatively long period of time, and the particle cleaning efficiency is not high
In addition, since the particles cannot leave the brush in time and stay between the brush bristles for a long time, the particles are prone to scratch and secondary contamination on the surface of the silicon wafer

Method used

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  • Brush head for cleaning silicon chip
  • Brush head for cleaning silicon chip

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Embodiment Construction

[0008] The brush chip head for cleaning silicon wafers of the present invention includes a plurality of brushes, and the brushes can be driven by the brush driving mechanism to rotate at different speeds. The planetary gear can be used to make the brush produce different speeds.

[0009] As shown in the drawings, in one embodiment of the present invention, the brush drive mechanism includes a planetary gear 1, a power gear 2, a motor 4, a bearing 5, and a connector bracket 6, and the power gear 2 is connected to the motor through the bearing 5 4, and the motor 4 drives the power gear 2, the planetary gear 1 and the power gear 2 are connected in a meshing manner, and relatively rotated under the drive of the power gear 2, and the connector bracket 6 is used for The planetary gear 1 is fixedly connected, and brushes 3 are arranged under the rotating shafts of the planetary gear 1 and the power gear 2, and the vertical pressure and position of each brush 3 on the silicon chip can...

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Abstract

The invention relates to a brush head of silicon wafer surface cleaning equipment and discloses a brush head for cleaning a silicon wafer. The brush head comprises at least two brushes capable of being driven by a brush drive mechanism to rotate at different speeds. The brush head for cleaning the silicon wafer can effectively improve the removal rate of particles on the silicon wafer surface, andprevent the silicon wafer surface from being scored or contaminated secondarily by the particles between the brushes.

Description

technical field [0001] The invention relates to a chip brush head of silicon wafer surface cleaning equipment, in particular to a chip brush head capable of improving the efficiency of chip brushing. Background technique [0002] At present, the brush head (brush) of the chip brushing machine only relies on the rotation of the silicon chip itself and the simple rotation of the brush to enhance the cleaning efficiency when scrubbing the back of the silicon chip. Moreover, because the movement of the silicon wafer and the brush is relatively slow, there is no reciprocating movement (only horizontal movement) for a relatively long period of time, and the particle cleaning efficiency is not high. In addition, since the particles cannot escape from the brush in time and stay between the bristles of the brush for a long time, the particles are prone to scratches and secondary contamination on the surface of the silicon wafer. Contents of the invention [0003] The technical pro...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): A46B13/02A46B7/08B08B1/04
Inventor 宁开明伍强毛玮陈志刚
Owner SHANGHAI HUAHONG GRACE SEMICON MFG CORP
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