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High temperature resistant epoxide resin conductive adhesive

A technology of epoxy resin and conductive adhesive, which is applied in the field of conductive adhesive, can solve the problem of low heat resistance of conductive adhesive, improve electrical conductivity or thermal conductivity, improve heat resistance and high temperature stability, and improve high temperature performance Effect

Inactive Publication Date: 2008-11-12
SHANGHAI SHANG DA RUI HU MICROSYST INTEGRATION TECH CO LTD SMIT
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to provide a high temperature resistant epoxy resin conductive adhesive to solve the problem of low heat resistance of current conductive adhesives, and at the same time use different fillers to achieve good electrical conductivity

Method used

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  • High temperature resistant epoxide resin conductive adhesive

Examples

Experimental program
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Effect test

Embodiment 1

[0021] In this embodiment, the total weight of the high temperature-resistant epoxy resin conductive adhesive is 10g, and its composition is calculated by weight fraction:

[0022] Modified epoxy resin 25 parts

[0023] Silicone coupling agent 0.2 parts

[0024] 1 part of imidazole curing agent

[0025] Micron silver powder 70 parts

[0026] Nano silver particles 5 parts

[0027] Mix the above well, then cure at 150°C for 30 minutes. The measured Tg is 200°C and the resistivity is 4×10 -5 Oh cm.

Embodiment 2

[0029] In this embodiment, the total weight of the high temperature-resistant epoxy resin conductive adhesive is 10g, and its composition is calculated by weight fraction:

[0030] Modified epoxy resin 25 parts

[0031] Silicone coupling agent 0.3 parts

[0032] 1.5 parts of imidazole curing agent

[0033] Micron silver powder 75 parts

[0034] Nano silver particles 5 parts

[0035] Carbon nanotubes 2.5 parts

[0036] The cross-sectional diameter of the carbon nanotubes is 30 nanometers, the above is mixed evenly, and then cured at 150° C. for 30 minutes. The conductive adhesive meeting the requirements of the present invention can be obtained.

Embodiment 3

[0038] In this embodiment, the total weight of the high temperature-resistant epoxy resin conductive adhesive is 10g, and its composition is calculated by weight fraction:

[0039] Modified epoxy resin 20 parts

[0040] Silicone coupling agent 0.15 parts

[0041] 1 part of imidazole curing agent

[0042] Micron silver powder 60 parts

[0043] Nano silver particles 3 parts

[0044] Carbon nanotubes 3 parts

[0045] The cross-sectional diameter of the carbon nanotubes is 30 nanometers, the above is mixed evenly, and then cured at 150° C. for 30 minutes. The conductive adhesive meeting the requirements of the present invention can be obtained.

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Abstract

The invention discloses high-temperature resistant epoxy resin conductive adhesives, which are characterized by comprising the following compositions by weight portion: 10 to 25 portions of modified epoxy resins, 0.05 to 0.5 portions of organosilicon coupling agent, 0.1 to 2 portions of imidazole curing agent, 60 to 80 portions of micron silver powder, 0.05 to 5 portions of nano silver particles and 0 to 5 portions of carbon nanotube. The modified epoxy resins simultaneously use a proper amount of coupling agent to replace epoxy resins which are generally adopted in the market, thereby the high-temperature resistance of the adhesives is greatly improved; due to addition of the micro silver powder and the nano silver particles or the carbon nanotube, the conductivity of the adhesives is greatly improved; and due to addition of the electricity and heat conducting carbon nanotube, the electroconductibility and the thermal conductivility of the adhesives are improved.

Description

technical field [0001] The invention relates to a high-temperature-resistant epoxy resin conductive glue, which belongs to the technical field of conductive glue. It is used in the place where the circuit needs to be connected in the process of electrical and electronic packaging, and it is used instead of welding. Background technique [0002] Conductive adhesive is an adhesive variety suitable for the development of the electronics industry. It is used in electrical and electronic packaging where the circuit needs to be connected to replace soldering. Conductive adhesives are composed of conductive fillers, solvents and additives. At present, many electronic components are beginning to be miniaturized, and some difficult-to-solder materials and polymer materials with low heat resistance are used. If traditional welding methods are used, components are easily damaged, and precise micro-soldering is also difficult to control. It will cause unreliable welding, deformation o...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/00C09J9/02C09J11/02
Inventor 刘建影
Owner SHANGHAI SHANG DA RUI HU MICROSYST INTEGRATION TECH CO LTD SMIT
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