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Light-sensitive polymer composition with low surface stickiness and application thereof

A technology of photosensitive resin and composition, which is applied in the field of photosensitive resin composition, which can solve the problems of difficult film positioning, easy to stick dust, difficult to peel off, etc., to reduce surface adhesion, strengthen curing, improve water resistance and water resistance. solvent effect

Active Publication Date: 2008-10-08
村上化工(中山)有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, for photocurable vinyl-based compounds, the surface of the photosensitive film before photocuring has strong adhesion, and it is difficult to peel off the original film for exposure. Due to the strong surface adhesion, not only the positioning of the film is difficult, but also the surface is easy to stick Foreign matter such as dust

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0027] 10 parts of synthetic silica with an average particle diameter of 6.4 μm [SYLYSIA370P manufactured by Fuji Sylysia Chemical Co., Ltd.] and 12% by weight of polyvinyl alcohol with a degree of polymerization of 1700 and a degree of alkalinity of 88 mol% [PVA-210 manufactured by Nippon Gosei Co., Ltd.] 40 parts of the aqueous solution were mixed together, and then 10 parts of block isocyanate (CORONATE 2513 produced by Japan Polyurethane Industry) and 10 parts of photocuring initiator diethylthioxanthene [KAYACURE-BP- produced by Japan Chemical Industry Co., Ltd. 100] 0.2 parts and 0.1 part of polymerization accelerator amine compound [KAYACURE-EPA manufactured by Nippon Kayaku Co., Ltd.] 0.1 part is emulsified by dissolving and mixing acrylate monomer [A-TMM-3 manufactured by Shin Nakamura Chemical Co., Ltd.] 1 part of post-light curing agent P-diazodiphenylamine sulfate paraformaldehyde condensate was mixed together to form a photosensitive resin composition, and then a c...

Embodiment 2

[0029] 10 parts of synthetic silica with an average particle diameter of 6.4 μm [SYLYSIA370P produced by Fuji SYLYSIA Chemical Co., Ltd.] and polyvinyl alcohol with a degree of polymerization of 1700 and a degree of alkalinity of 88 mol% [PVA-210 produced by Nippon Gosei Co., Ltd.] were added 12 10 parts of block isocyanate (CORONATE 2513 manufactured by Nippon Polyurethane Industry Co., Ltd.) and photopolymerization initiator diethylthioxanthene [KAYACURE-BP-100 produced by Nippon Kayaku Co., Ltd.] 0.2 parts and 10 parts of polymerization accelerator amine compound [A-TMM-3 produced by Nippon Kayaku Co., Ltd.] were emulsified to form a photosensitive resin composition, Then the garden screen printing plate was made by the method of comparative example 1.

[0030] Table 1 shows the comparative evaluation results of Comparative Examples 1 to 4 and Examples 1 and 2. Expansion rate is the expansion rate of taking test piece 3cm * 3cm size on the printing plate for circular scree...

Embodiment 3

[0034] Synthetic silica powder containing styryl pyridyl or styryl quinolinyl, water-soluble polyvinyl with an alkalization degree of 60% or more, and an average particle size of 3.5 to 9.0 μm covered with hydroxyl groups on the surface (Chem. 2) and a compound that can harden under the action of heat to form a photosensitive resin composition. The photosensitive resin composition comprises 0.1wt% of synthetic silica powder (A), 50wt% of water-soluble binder polymer (B), 0.1wt% of photocuring compound (C), 40wt% of thermosetting compound (D), weight Nitrogen resin or dichromate (E) 0.1wt%, defoamer 0.2wt%, leveling agent 0.5wt%, colorant 0.5wt%, preservative 0.1wt%, organic / inorganic filler 5wt%, organic solvent 3.2 wt%, plasticizer 0.1wt%, surfactant 0.1wt%.

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PUM

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Abstract

The invention relates to a phototonus resin composite of low surface adhesiveness and its application. The composite comprises a 0.1 to 50 wt percent mixing silica powder, 0.1 to 50 wt percent water solubility bond polymer, 0.1 to 50 wt percent photocureable compound, 0.5 to 40 wt percent thermosetting compound, 0.1 to 10 wt percent diazonium resin or bichromate and proper additive. Compared with the prior art, the invention has the characteristics of improving water resistance and solvent resistance, without damage to image resolution and low surface adhesiveness.

Description

technical field [0001] The invention relates to the technical field of organic polymer materials, in particular to a photosensitive resin composition with low surface adhesion and its application. Background technique [0002] At present, there are many types of photosensitive materials that can be developed with water, but they are all water-soluble resins containing hydrophilic groups, so images with good water resistance cannot be obtained. For good water developability, water-soluble compounds and surface active materials are added. As an emulsifiable compound with a hydrophilic group, the hydrophilicity remains after photocuring. Therefore, it is impossible to have sufficient water resistance, and when it is used in printing, the pigments and dyes in the printing paste penetrate into the image and react with the hydroxyl group of the water-soluble polymer in the image forming product to contaminate the image. [0003] In order to avoid these disadvantages, dichromate h...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/075G03F7/021G03F7/028G03F7/004G03F7/09
Inventor 石井智彦安达大作近江护李龙虎
Owner 村上化工(中山)有限公司
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