Single-crystal silicon chip water-base cleaning agent

Abstract

The invention discloses a monocrystalline silicon slice water-based cleaning agent, which is characterized in that the cleaning agent is fluorescent yellow transparent liquid, and has the following components and the weight percentage compounding ratio: surface active agent 20-40, dissolving agent 5-15, conditioning agent 15-20, brightening agent 10-20, and deionized water 30-45. The surface detergency is improved and the constancy of the cleanliness is kept through utilizing the compound property of the surface active agent; simultaneously, the cleaning agent can ensure that the silicon slice after being cleaned is free from water trace and brighter, and has good cleaning effect to monocrystalline silicon slices and other materials; and the cleaning speed and the durability are improved. The compound concentration is low, and the used material quantity is less, therefore the use-cost of users is reduced, and the sewage discharge is reduced, so as to achieve the purposes of energy conservation and emission reduction.

Description

Technical field: [0001] The invention relates to an ultrasonic cleaning agent for silicon wafers, in particular to a water-based cleaning agent for monocrystalline silicon wafers that can improve the detergency, cleaning speed and durability. Background technique: [0002] The silicon wafer first cuts the silicon rod into slices, goes through the processes of grinding, polishing, and etching to obtain a smooth and clean surface, and then goes through complex processing processes such as cleaning, oxidation, photolithography, epitaxial growth, and solid-state diffusion. Form semiconductor materials. The cleaning is mainly to remove sand particles, residual water-soluble wire cutting suspension, metal ions, fingerprints, etc. generated during the cutting process. The cleaning effect will directly affect the quality of the silicon wafer. It must meet the requirements of thorough descaling, no corrosion and oxidation. Technical requirements such as residues. At present, there is no s...

AI Technical Summary

Problems solved by technology

At present, there is no ultrasonic cleaning solution dedicated to monocrystalline silicon wafers. The existing cleaning agents have the disadvantages of poor decontamination ability, slow cleaning speed and poor durability, resulting in high concentration and large dosage of cleaning agents for operation, which directly increases Increased production costs, while changing tanks frequently and frequently, increased sewage discharge, which is not conducive to environmental protection