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Method for manufacturing wafer-stage glass micro-cavity

A manufacturing method and glass microtechnology, applied in the field of MEMS manufacturing, can solve the problems of high cost, inability to precisely control the size of the microcavity, low efficiency, etc., and achieve the effects of good airtightness, high bonding strength and low roughness

Inactive Publication Date: 2008-09-10
SOUTHEAST UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The traditional wet etching Pyrex7740 glass process is isotropic etching, so it is impossible to precisely control the size of the microcavity while providing a deep cavity
If the DRIE method is used to etch the Pyrex7740 glass with SF6 gas, it is necessary to use metal Cu, Cr, etc. as a mask for etching, which is inefficient and expensive

Method used

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  • Method for manufacturing wafer-stage glass micro-cavity
  • Method for manufacturing wafer-stage glass micro-cavity
  • Method for manufacturing wafer-stage glass micro-cavity

Examples

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Embodiment 1

[0024] A method for manufacturing a wafer-level glass microcavity, comprising the following steps:

[0025] In the first step, a specific pattern is formed on a Si wafer (such as a 4-inch wafer) by etching using a Si micromachining process, and the micromachining process of the pattern structure on the Si original wafer is a wet etching process or a dry inductively coupled plasma One of the bulk (ICP) etching process, reactive ion etching or deep reactive ion etching, the pattern can be a square or circular groove array, or a number of different graphics, (in fact, three-dimensionally, To engrave a specific pattern is to engrave a groove on a silicon wafer, and it is a pattern in two dimensions)

[0026] In the second step, the above-mentioned Si wafer and the Pyrex7740 glass wafer (a brand of borosilicate glass, produced by Corning-corning Company in the United States, available in the market, usually polished, and its size is the same as the Si wafer) in less than Bonding i...

Embodiment 2

[0031] A method for manufacturing a wafer-level glass microcavity, comprising the following steps:

[0032] The first step is to etch a specific pattern on a 4-inch Si wafer by using deep reactive ion etching (in fact, in three dimensions, it is a groove on the silicon wafer, and in two dimensions, it is a pattern). The pattern is a square groove array , the aspect ratio of the pattern is 20:1, the silicon wafer is polished,

[0033] In the second step, the above-mentioned Si wafer and (4 inches) Pyrex7740 glass wafer of the same size (a kind of brand of borosilicate glass, produced by Corning-corning Company in the United States, available in the market, have been polished) at 0.5Pa The bonding is carried out under the atmosphere, and the bonding is carried out on the EVG-501 anode bonding machine, so that the above-mentioned specific pattern on the Pyrex7740 glass forms a sealed cavity, and the bonding surface is routinely cleaned and polished according to the requirements o...

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Abstract

The invention provides a fabrication method for a wafer-class glass micro-chamber, comprising the steps as follows: a first step: a special pattern is etched on a Si wafer to form a special pattern by a Si micro-machining process; a second step: the Si wafer and a Pyrex7740 glass wafer are bonded to each other under the atmosphere of less than 1Pa, thus leading the special pattern on the Pyrex7740 glass to form a sealing chamber body; a third step: the bonded wafers are heated to 810 to 890 DEG C under one atmosphere and the temperature is kept, the pressure different inside and outside the chamber leads the softened glass to form a structure corresponding to the micro-chamber pattern structure which is then cooled, and the wafer is annealed to eliminate the stress under normal pressure. The fabrication method of the wafer-class glass micro-chamber has the characteristics of simple process, precise forming, high depth-width-ratio of micro-chamber transmission, good surface characteristic of the micro-chamber, etc., can be widely applied to the fabrication of glass micro-chamber in an MEMS (micro-electron mechanical system), and belongs to wafer-class MEME fabrication process.

Description

technical field [0001] The invention relates to a MEMS (micro-electro-mechanical system) manufacturing technology, in particular to a method for manufacturing a wafer-level glass microcavity. Background technique [0002] In the field of MEMS manufacturing technology, Pyrex7740 glass (a glass containing alkaline ions, Pyrex is Corning's product brand) is an important material. It has a thermal expansion coefficient similar to that of Si materials, and has high light transmittance. High strength, and can form a high-strength bonding connection with the Si substrate by using the anodic bonding process, and a strong Si-O covalent bond is generated on the bonding surface, and its strength is even higher than that of the Si material itself. Due to such characteristics, Pyrex7740 glass is widely used in MEMS packaging, microfluidics and MOEMS (micro-optical electro-mechanical systems) and other fields. [0003] In the field of MEMS packaging, since devices generally contain movab...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B81C3/00
Inventor 黄庆安柳俊文唐洁影尚金堂
Owner SOUTHEAST UNIV
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