Semiconductor device and method of manufacturing the same
A manufacturing method and semiconductor technology, which are applied in the fields of semiconductor/solid-state device manufacturing, semiconductor devices, electric solid-state devices, etc., to achieve the effect of improving the qualification rate and reducing the number of manufacturing processes
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[0037] Hereinafter, a semiconductor device and a manufacturing method thereof according to an embodiment of the present invention will be described with reference to the drawings.
[0038] Here, a multi-chip module (resin-molded semiconductor device) is described as an example in which a plurality of semiconductor elements are arranged on the same surface, and one module is resin-sealed to realize multi-chip multi-chip.
[0039] Fig. 7 is a perspective view showing an example of the structure of a resin-molded semiconductor device according to an embodiment of the present invention. In the drawings, the sealing resin is not shown in order to show the structure of the resin-molded semiconductor device.
[0040] In FIG. 7 , 41 is a flat bare chip base (semiconductor element mounting portion) of the lead frame, 42 is a lead end of the lead frame, 43 is a suspension lead that is a part of the lead end, and 44 is a current that needs to flow to the bare chip base 41. 45 is a contr...
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