Chip resistor and its manufacturing method

Abstract

To provide a chip resistor so constituted that even if the chip resistor is mounted in a horizontal posture, the soldering strength is ensured, there is no apprehension that the chip resistor projects from the accommodation recess of a positioning tool in the mounting step, the promotion of miniaturization is not hindered, and the appearance of the chip resistor is favorable and its manufacturing method. When chip resistors (10) are produced, front electrodes (12) and resistor bodies (13) are fabricated in the front surface (20a) of a large board (20) and back electrodes (16) are fabricated on the back surface (20b) of the large board (20). When the back electrodes (16) are fabricated, the back electrodes (16) are extended on an inclining surface of V-grooves formed in the back surface (20b) as secondary split grooves (22) and the extending portions are used as side electrodes (16a). The large board (20) is cut along primary grooves (21) into rectangular pieces, edge electrodes (17) are formed on the cut surface by sputtering, and the rectangular boards (24) are cut along the secondary grooves (22) into chips. Each chip is plated, thus producing a chip resistor (10) having a shape of a generally rectangular solid and electrodes exposed on the sides.

Description

technical field [0001] The present invention relates to square chip resistors mass-mounted by multiple mounting methods and a manufacturing method thereof. Background technique [0002] Recently, the technique of mass-mounting chip components such as chip resistors by multiple mounting methods has become widespread. In this multi-mounting method, a positioning jig called a template is used, which is provided with a large number of accommodation recesses in accordance with the arrangement on the circuit board. After the chip components are removed, the chip components in the respective housing recesses are collectively mounted on the circuit board by a mounter having suction nozzles (nozzles), so that the mounting speed can be significantly improved. [0003] FIG. 9 is a perspective view showing a conventional square chip resistor corresponding to such a multiple mounting method (for example, refer to Patent Document 1). The chip resistor 1 shown in the same figure includes...

AI Technical Summary

Problems solved by technology

In addition, since the width dimension of the insulating substrate 2 is larger than the thickness dimension, when it is placed in the accommodation recess of the positioning jig (sample) in a horizontal posture, a part of the insulating substrate 2 protrudes greatly above the positioning jig. , so that there is a problem that shock is applied to the suction nozzle and the chip resistor 1 at the time of mounting and is easily damaged

[0008] In addition, although the miniaturization of chip resistors has been promoted in recent years, and for example, extremely small chip resistors with a length dimension of 1 mm and a thickness dimension of 0.5 mm are also becoming popular, it is difficult to manufacture such ultra-small chip resistors. Thick end-face electrodes are formed with high precision on a rectangular substrate, and the method of forming thin end-face electrodes by sputtering is generally used

However, when forming the end surface electrodes by sputtering, the side electrodes cannot be formed simultaneously in the divided grooves, so the solder connection strength is insufficient when the chip resistor is mounted on the circuit board in a lateral orientation.

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