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Alkaline-based developer composition

A composition and developer technology, applied in the processing of photosensitive materials, etc., can solve problems such as metal ion residues, residues, and impact on product quality

Active Publication Date: 2008-05-14
ECHEM SOLUTIONS
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  • Abstract
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  • Application Information

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Problems solved by technology

[0003] Furthermore, after the photosensitive resin composition is coated, pre-baked, and exposed, although an alkaline developer can be used to dissolve and remove the unexposed coating, it may also be prone to undeveloped during development. Particles (or undissolved particles) remain, which makes it difficult to form an accurate photoresist image after development; especially, in the more advanced liquid crystal display (LCD) circuit process, if there are residues or metal ions remaining Phenomenon, will be enough to seriously affect the quality of the product
[0004] In the existing technical field, although Japanese Patent Application Laid-Open No. 10-10749 patent document discloses a developer composition composed of water, alkaline compound, and anionic surfactant, in order to obtain no residue and better image development However, in actual application, the defoaming performance, operating temperature, and color photoresist dispersion stability of this conventional developer composition are not as ideal as expected, and cannot fully respond to the diverse developability of color photoresists.

Method used

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Embodiment Construction

[0009] In order to make your examiner understand the main technical content and implementation mode of the present invention, the description is as follows with the help of drawings:

[0010] The alkaline developing solution composition of the present invention is a kind of alkaline developing solution applied to the image formation of photosensitive resin after ultraviolet (UV) exposure, and its composition includes:

[0011] (A) Pure water is mainly used as the dispersing medium of the developer. Since water itself is not toxic and flammable, using pure water as the dispersing medium of the developing solution is not only low cost, but also the raw material itself is easier to manage, and the waste liquid Handling is also easier.

[0012] (B) at least one basic compound, mainly used to dissolve the resin of the non-image part, which can be selected from: (1) alkali metal, alkaline earth metal hydroxide; (2) alkali metal, alkaline earth metal carbonate and bicarbonate; or (3...

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Abstract

The alkaline developing solution of the present invention is applied to image formation after photosensitive resin is exposed to ultraviolet (UV), and its composition includes (A) pure water, (B) at least one basic compound, (C) content A defoamer less than 500ppm, (D) at least one nonionic surfactant with a total content of 0.05 to 10%; wherein, the structural formula of the nonionic surfactant is: the key point is: in the structural formula of the nonionic surfactant R1 is hydrogen (-H) or methane (-CH3); EO is polyoxyethylene; PO is polyoxypropylene, m and n cannot be zero at the same time, m+n is less than 25, and R2 is Hydrophobic base.

Description

technical field [0001] The invention relates to a developing solution composition, especially an alkaline developing solution composition used for image formation after photosensitive resin is exposed to ultraviolet (UV). Background technique [0002] In order to manufacture tiny circuit patterns used in semiconductor integrated circuits or liquid crystal display (LCD) circuits, a photoresist including polymer resin, photosensitive compound and solvent is evenly covered or coated on an insulator layer or conductive metal layer on the substrate The composition, the covered or coated substrate is warm baked to evaporate the solvent, the warm baked substrate is selectively exposed to some type of radiation such as ultraviolet light, electrons or X-rays, the exposed substrate is then heat baked, and then heat baked The substrate is developed to produce the expected pattern, and the developed substrate is etched to remove the insulator layer or the conductive metal layer, and the...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/32
Inventor 郭光埌戴伟仁
Owner ECHEM SOLUTIONS
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