Integrated heat radiation method, system and corresponding heat radiation device

Abstract

This invention relates to an integrated radiation method, a system and a corresponding radiation device, which installs a radiator on each chip mounted on a CB and sets a connecting unit between two adjacent radiators to form a cascade chain to radiate for the covered chips, in which, chips at high temperature trabsmit heat to radiators with low temperature via the chain so as to provide a fine radiation performance for chips on a CB.

Description

technical field [0001] The invention relates to the technical field of heat dissipation of electronic devices, in particular to an integrated heat dissipation method, system and corresponding heat dissipation device applied to a plurality of electronic chips mounted on a printed circuit board. Background technique [0002] With the improvement of the operating frequency and integration of electronic chips on the circuit board, the power of the electronic chips is increasing, and the heat generation is also increasing. The generation of a large amount of heat will make the temperature of the electronic chip continue to rise. Excessive temperature will seriously affect the performance of the electronic chip, and then affect the performance of the circuit board carrying the chip and the whole system. Therefore, the chip, circuit board and the whole system The problem of heat dissipation has become more and more prominent with the development of chip technology. Poor heat dissi...

AI Technical Summary

Problems solved by technology

However, the main disadvantage of this method is that devices with the same height must be used, and the elastic thermal pad generally has poor thermal conductivity, which increases thermal resistance

As the number of devices covered by the heat sink increases, the effective contact area between the heat sink and the chip will decrease due to the height error between the devices, and the heat dissipation performance will deteriorate rapidly as the number of devices covered by the heat sink increases.

Images