Cooling device and assembling body

Abstract

To provide a cooling device having a plurality of cooling units, wherein, each cooling unit has a cooling tower part, cooling device part and tubing series arranged at single side embedding board, the cooling tower part has: a heat radiation mechanism having a pipeline circulating the cooled fluid; a condenser arranged by abutting against the heat radiation mechanism, having pipeline for circulating refrigerant during executing heat radiation course of refrigeration cycle; a composite heat radiation device arranged by abutting against the condenser, having inspiration fan leading-in the environment gas to the around of the pipeline, the cooling device part has the condenser, and has an expansion valve, an evaporator and a compressor for executing the refrigeration cycle, the tubing serieshas a first tubing series for supplying the cooled fluid to the heat radiation mechanism and a second tubing series for leading the cooled fluid to outflow from the heat radiation mechanism, one partof the second tubing series passes through the evaporator, the inspiration fan of the cooling unit is relatively arranged with regulated alternation.

Description

technical field [0001] The present invention relates to a composite heat sink for cooling water to be cooled returned from an external device and sending it to the external device, a cooling unit provided with the composite heat sink, a cooling device having a plurality of cooling units, and an assembly thereof. Background technique [0002] Cooling fluid (refrigerant) is used to cool various devices such as semiconductor manufacturing devices and mold devices for resin molding, and the refrigerant coming out of the devices is cooled to 15 to 30°C in order to reuse them. As a device for cooling the refrigerant to about 18-29°C, for example, Japanese Patent Publication No. 7-48032 proposes a cooling device which integrally has a closed evaporative cooling tower and a cooling unit in the same frame. The type cooling tower is equipped with a cooling section with multi-layer heat pipes, a device for spraying water in the cooling section, and a cooling fan for ventilation to the ...

AI Technical Summary

Problems solved by technology

For this reason, it is necessary to increase the radius of the fan and install multiple fans, but if the radius of the fan becomes larger, the noise during operation will increase

In addition, if multiple fans are installed in parallel, the fans will suck air from each other, resulting in uneven air intake (so-called drift phenomenon), and uneven stress will be repeatedly applied to the rotating shaft or blades of the fan, resulting in damage to the rotating shaft and blades. possibility of

[0005] Also, in the structure in which a fan is installed on the upper part of the device, (a) because the distance between the upper part and the lower part of the condenser and the fan is different, there is a difference in the flow rate of the outside air passing through the upper part and the lower part of the condenser, so not only the cooling efficiency is low; (b) Since it is necessary to form a closed space (chamber) between the fan and the condenser from the standpoint of cooling performance, it is necessary to provide a bottom plate between the cooling tower and the cooler unit, or to separate the sides of the cooling tower and Side panels are installed to isolate the outside air

Therefore, the number of parts and the number of assembly man-hours increase, and the cost of the cooling device increases

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