Method for preparing micrometer and submicron probe arrays
A submicron, needle array technology, applied in the field of preparation of nano- and micro-structured materials, can solve problems such as limiting the application field and scope, and achieve the effects of short preparation cycle, simple operation, and reduced preparation cost
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Embodiment 1
[0020] Example 1: SiO with a diameter of 8 microns 2 Fiber obtains SiO through self-assembly technology 2 Fiber bundle; then put it into the MMA (polymethyl methacrylate) solution with BPO, place it in a water bath and heat it at 60℃ for 24h to solidify the polymer, SiO 2 The volume ratio of the fiber bundle to the polymer cured product is 0.1; then, it is cut into slices with a thickness of 1 mm, and then corroded with a 40% HF acid solution at a constant temperature of 30°C for 5 minutes, ultrasonically cleaned with deionized water, and dried to obtain a nanoneedle array.
Embodiment 2
[0021] Example 2: SiO with a diameter of 8 microns 2 Fiber obtains SiO through self-assembly technology 2 The fiber bundle; then put it into the styrene solution added with hexamethyleneimine lithium, and heat it in a water bath at 60℃ for 24h to solidify the polymer; SiO 2 The volume ratio of the fiber bundle to the polymer cured product is 0.3; then it is cut into slices with a thickness of 3mm; it is corroded with a 20% HF acid solution at a constant temperature of 30°C for 30 minutes, ultrasonically cleaned with deionized water, and dried to obtain a nanoneedle array;
Embodiment 3
[0022] Example 3: SiO2 fibers with a diameter of 8 microns are obtained by self-assembly technology 2 Fiber bundle; then immerse it in the molten resin at 120℃, and cool the slice after filling, SiO 2 The volume ratio of the fiber bundle to the polymer cured product is 0.6; the slice thickness is 1cm; it is etched with 40% HF acid solution for 10 minutes at a constant temperature of 40°C, and then cleaned with deionized water ultrasonically. After drying, the nanoneedle array can be obtained, as shown in Figure 2.
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