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Resin composition capable of polymerizing

A technology for polymerizing resins and polymer compounds, used in coatings, instruments, organic chemistry, etc., can solve problems such as high sublimation, reduced transmittance of coating films or patterns, and reduced product yields

Active Publication Date: 2008-02-13
SUMITOMO CHEM CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] However, when such a composition is used, there is a problem that although sufficient sensitivity is obtained, the transmittance of the resulting coating film or pattern decreases because of the maximum absorption wavelength in the range of 350 to 450 nm
If the sublimation is high, it will contaminate the inside of the baking furnace in the post-baking, resulting in a decrease in the yield of the product

Method used

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  • Resin composition capable of polymerizing
  • Resin composition capable of polymerizing
  • Resin composition capable of polymerizing

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0244] The following components were mixed: 169 parts (55 parts in terms of solid content) of resin solution (A) containing resin (i) obtained in Synthesis Example 1, 45 parts of dipentaerythritol hexaacrylate (B), 4 parts of 2,2'-bis(2-chlorophenyl)-4,4',5,5'-tetraphenylbiimidazole (C), 0.5 parts of 2-(2-naphthoylmethylene)- 3-Methylbenzotriazoline (C-1), 4 parts of pentaerythritol tetrathiopropionate (T), 56 parts of propylene glycol monomethyl ether acetate (D) and 40 parts of 3-ethoxyethyl propionate to obtain polymerizable resin composition 1.

[0245] Table 1

[0246] Example 1

Example 2

Example 3

Comparative example 1

Comparative example 2

polymerizable resin

Composition 1

polymerizable resin

Composition 2

polymerizable resin

Composition 3

polymerizable resin

Composition 4

polymerizable resin

Composition 5

Resin (A)

Resin Aa (solid content only)

55

55

55 ...

Embodiment 2

[0261] Polymerizable resin composition 2 was obtained in the same manner as polymerizable resin composition 1 to provide the formulations shown in Table 1, and evaluated. The results are described in Table 2.

Embodiment 3

[0263] Polymerizable resin composition 3 was obtained in the same manner as in Example 1 to provide the formulations shown in Table 1, and evaluated. The results are described in Table 2.

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PUM

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Abstract

A polymerisable resin compound, which comprises (A) resin, (B) polymerisable compound, (C) initiating agent, (C-1) initiating adjuvant, (T) polyfunctional mercaptan compound and (D) solvent, the initiating adjuvant (C-1) contains compound of formula (V), in which the point line showed by the X means aromatic loop, Y means oxygen atom or sulfur atom, R<1> means alkyl containing one to six carbon atoms, R<2> means the alkyl containing one to twelve carbon atoms replaced by halogen atom or the aryl containing six to twelve carbon atoms replaced by halogen atom.

Description

technical field [0001] The present invention relates to a polymerizable resin composition. Background technique [0002] It has been proposed to form a spacer (photo spacer) between a color filter and an array substrate constituting a display, such as a liquid crystal display, a touch panel, etc., by photolithography using a photosensitive resin. According to this method, spacers can be formed at any position. [0003] Currently, light emitted from a mercury lamp used as a light source for photolithography typically has a high-intensity spectrum at about 436 nm, about 408 nm, about 365 nm, about 313 nm, about 315 nm, about 313 nm, and the like. [0004] As an exposure apparatus used in an actual photo-spacer forming method, a proximity exposure apparatus and a stepper (stepper) are generally used, and in many cases, when short-wavelength cut-off light is less than 350 nm, a recent Proximity exposure device. In the stepper, light of about 408nm and about 365nm is used. ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L101/02C09D201/02C08K5/46C08K5/35
CPCC07D263/52C07D277/60C07D303/06C08F2/04C08F2/44C08F20/06C08F20/10C08F22/02C08F22/04C08F22/10C08F220/04C08F220/12C08J5/2231G02F1/1339G03F7/031
Inventor 武部和男
Owner SUMITOMO CHEM CO LTD
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