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Leadframe having a heat sink supporting ring, fabricating method of a light emitting diodepackage using the same and light emitting diodepackage fabbricated by the method

A technology of light emitting diodes and heat sinks, applied in the field of lead frames, can solve the problems of unstable LED packaging structure, damage to LED packaging, separation of heat sinks, etc.

Active Publication Date: 2007-11-28
SEOUL SEMICONDUCTOR
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] However, the structure of the existing LED package is unstable because the heat sink may be easily separated from the package body
When the heat sink is separated from the package body, the bonding wires of the electrical connection leads and the LED die mounted on the upper part of the heat sink are cut off, causing irreparable damage to the LED package

Method used

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  • Leadframe having a heat sink supporting ring, fabricating method of a light emitting diodepackage using the same and light emitting diodepackage fabbricated by the method
  • Leadframe having a heat sink supporting ring, fabricating method of a light emitting diodepackage using the same and light emitting diodepackage fabbricated by the method
  • Leadframe having a heat sink supporting ring, fabricating method of a light emitting diodepackage using the same and light emitting diodepackage fabbricated by the method

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Embodiment Construction

[0036] Reference will now be made in detail to the preferred embodiments of the invention, examples of which are illustrated in the accompanying drawings.

[0037] FIG. 1 is a perspective view of a lead frame according to one embodiment of the present invention.

[0038] Referring to FIG. 1 , the lead frame 10 includes a heat sink support ring 13 into which a heat sink can be inserted. The support ring 13 may be formed in a circular ring shape as shown in FIG. 1 , but its shape is not limited thereto, but may be formed in a polygonal ring shape.

[0039] The support ring 13 is enclosed by the outer frame 11 . The outer frame 11 is spaced apart from the support ring 13 . The outer frame 11 may be formed in a square shape as shown in FIG. 1, but its shape is not limited thereto, but may be formed in a circular shape or a polygonal shape.

[0040] The outer frame 11 and the support ring 13 are connected to each other via at least one support lead 15a and / or 15b. The support r...

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Abstract

There are provided a leadframe, a method of fabricating a light emitting diode package using the leadframe, and the light emitting diode package fabricated by the method. The leadframe includes a heat sink supporting ring for supporting a heat sink. An outer frame is spaced apart from the heat sink supporting ring, and encloses the heat sink supporting ring. At least one supporting lead connects the heat sink supporting ring and the outer frame. A separated lead is extended from the outer frame toward the heat sink supporting ring, and is spaced apart from the heat sink supporting ring. Consequently, since the package body can be formed by an injection molding after a heat sink is inserted into the leadframe, a LED package having structural stability and good heat dissipation can be fabricated with ease.

Description

technical field [0001] The present invention relates to a lead frame, a method of manufacturing a light emitting diode package using said lead frame and a light emitting diode package manufactured by said method, and more particularly to: a lead frame having a heat sink support ring, The heat sink support ring is capable of fixing the heat sink to a lead frame to prevent the heat sink from being separated from a package body; a method of manufacturing a light emitting diode package using the lead frame; and a light emitting diode package manufactured by the method. Background technique [0002] The lighting power of a light emitting diode (hereinafter referred to as LED) is substantially proportional to the input power. Therefore, high lighting power can be obtained by increasing the electric power input to the LED. However, an increase in input power results in an increase in the junction temperature of the LED. An increase in the junction temperature of an LED results in...

Claims

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Application Information

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IPC IPC(8): H01L33/00H01L33/62H01L33/64
CPCH01L2924/12041H01L2224/48091H01L2224/48247H01L2924/00014
Inventor 金度亨李贞勋李建宁
Owner SEOUL SEMICONDUCTOR
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