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Method of processing supersonic vibration machine grinding of sapphire steel bar

An ultrasonic vibration and grinding technology, applied in machine tools, metal processing equipment, grinding/polishing equipment, etc. suitable for grinding workpiece edges, which can solve the problem of poor surface roughness, long grinding and polishing time, and easy blockage of grinding wheels. and other problems, to achieve the effect of good surface quality, shortened grinding and polishing time, and low processing cost

Inactive Publication Date: 2007-09-26
HARBIN INST OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Due to the high hardness of sapphire material, when using this method to process sapphire rods, not only the processing efficiency is very low, the grinding wheel is easy to clog, but also the grinding wheel is severely worn, and the grinding wheel needs to be repaired and replaced frequently; More subsequent grinding and polishing time
Thereby the production cycle of this method is long, the cost is very high and other deficiencies, can no longer meet the requirements of modern production

Method used

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Examples

Experimental program
Comparison scheme
Effect test

specific Embodiment approach 1

[0016] Specific implementation method 1: 1. After the sapphire workpiece blank is oriented, the upper and lower surfaces are smoothed, bonded to the bakelite with wax glue, and then the bakelite is fixed on the machine tool workbench. Sealant glue is formulated according to the following mass percentages: paint flakes: 20%-40%, rosin: 20%-30%, calcium carbonate 20%-55%, castor oil 5%-10%; 2. Turn on the ultrasonic wave, at 17kHz Adjust the ultrasonic frequency between -23kHz to make it in a resonance state; 3. The coolant is supplied in two ways: internal cooling and external cooling; 4. Programming processing. A hollow thin-walled gold-plated steel tool with a particle size of 230#, an inner diameter of 20mm, a length of 50mm, and a wall thickness of 0.6mm is used to rotate at a speed of 4000r / min, while feeding along the Z axis at a speed of 5mm / min, and arrange Tool retraction action: that is, after the tool feeds 0.02mm, it retracts 0.01mm at a speed of 10mm / min, and every...

specific Embodiment approach 3

[0018] Specific embodiment three: it is realized according to the following steps: the 1st, 2, 3, 5 steps are the same as specific embodiment one, and the 4th step is: adopt granularity to be 120#, internal diameter is 51mm, length is 150mm, wall thickness is The 1.2mm hollow thin-walled metal bond sintered diamond tool rotates at a speed of 2000r / min, and at the same time feeds along the Z axis at a speed of 3.5mm / min, and arranges the tool retraction action: that is, after the tool feeds 0.02mm , retract 0.01mm at a speed of 7mm / min, the tool retracts to 2mm above the workpiece surface at a speed of 2000mm / min every time the tool feeds 1.2mm, and then the tool feeds to above the position before retracting at a speed of 2000mm / min 0.01mm continue to repeat the above processing action until the processing is completed. This scheme can obtain a sapphire rod with a diameter of 51 mm and a length of 150 mm. Surface roughness of sapphire rods up to R a 0.5μm, C-axis orientation ...

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Abstract

The invention relates to an ultrasonic vibration grinding machining method for sapphire bar. After the sapphire blank workpeice is located upper and lower surfaces are grinded flat and it is bonded on bakelite by sealing wax glue; then the bakelite is fixed on the working table of machine. The ultrasonic wave is started and the frequency of ultrasonic wave is adjusted in 17kHz-23kHz to make it in resonance state. The cooling liquid is started and the workpeice is cooled by inner and outer cooling ways. The ultrasonic vibration grinding machining is carried out. After machining is accomplished the sapphire workpeice and the bakelite are set on electrical furnace together to be heated to 115deg.C-125deg.C. The sapphire workpeice is fetched from the bakelite to obtain sapphire bar with diameter of 20-140mm and length of 50-150mm. the invention is provided with good machining surface quality and low producing cost so on. It has a wide applicable prospect and can create obvious social and economical benefits.

Description

(1) Technical field [0001] The invention belongs to a material processing method, in particular to a grinding method using ultrasonic vibration. (2) Background technology [0002] At present, sapphire rods are mainly ground by thin-walled diamond grinding wheels. Due to the high hardness of sapphire material, when using this method to process sapphire rods, not only the processing efficiency is very low, the grinding wheel is easy to clog, but also the grinding wheel is severely worn, and the grinding wheel needs to be repaired and replaced frequently; More subsequent grinding and polishing time. Thereby this method production cycle is long, and the deficiency such as high cost can not satisfy the requirement of modern production. (3) Contents of the invention [0003] The purpose of the present invention is to provide a method for ultrasonic vibration grinding of sapphire rods that can improve the quality of the processed surface, shorten the production cycle, improve p...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24B1/04B24B9/16B24B55/02C09J193/04C09J191/00
Inventor 韩杰才左洪波孟松鹤张明福杨鑫宏
Owner HARBIN INST OF TECH
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