Optoelectric composite substrate and electronic apparatus

Abstract

The photoelectric composite substrate 10 comprises a substrate 11, a printed wiring 12 and a thin optical element 13 formed on a front surface 11a side of the substrate 11. The thin optical element 13 has an electrode formed on its front surface, allowing at least inputting / outputting of light from the front surface, and the rear surface of it is mounted on the substrate 11 by bonding it to the front surface 11a of the substrate 11. The thin optical element 13 is covered with a lens mold 14. In the lens mold 14, a lens element 16 that refracts the light inputted / outputted with the thin optical element 13 is formed in a Fraunhofer region of the light inputted / outputted with the thin optical element 13. So the invention provides a photoelectric composite substrate, along with electronic equipment equipped with it, capable of preventing degradation in manufacture yield due to damage on a mold part with no increase of a manufacturing cost.

Description

technical field [0001] The present invention relates to a photoelectric composite substrate including electrical wiring and a photoelectric conversion element, and electronic equipment including the photoelectric composite substrate. Background technique [0002] In recent years, optical communication, which uses optical signals to send and receive information, has been widely used. Compared with electrical communication that uses electrical signals to send and receive information, optical communication has advantages such as reduced signal attenuation, increased amount of processed information, and prevention of radiation of electromagnetic waves to the surroundings. In the past, optical communication was generally limited to medium and long-distance communications of hundreds of kilometers or more, but in recent years it has also been widely used in short-distance communications of several kilometers, and it is also used in distances of several meters. Information communi...

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Problems solved by technology

In the Fraunhofer region, the laser can be shaped by lenses, etc., but in the Fresnel region, the laser cannot be converted into parallel light or concentrated light

Therefore, there is a restriction that the part where the microlens is formed must be separated from the light emitting part of the VCSEL by a certain distance (about 100 to 200 μm).

[0007] In view of the limitations of the above two points, when the planar area of ​​the VCSEL chip is about 500 μm, as disclosed in Non-Patent Document 1, the bottom area of ​​the mold part constituting the microlens cannot be taken as a sufficient area relative to its height.

Therefore, in the dicing process of cutting out each VCSEL from the substrate, damage such as bending, sagging, falling off, and bending of the mold part may occur, and it is not difficult to imagine that this will cause a decrease in manufacturing yield.

In order to prevent this damage, it should be enough to increase the bottom area of ​​the mold portion (the contact area with the substrate), but if the bottom area of ​​the mold portion is increased, the size of each VCSEL chip will be significantly increased, so that it can be obtained from one substrate. The number of VCSEL chips manufactured has been greatly reduced, resulting in an increase in manufacturing costs

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