Method for increasing metal magnetic multilayer film coercive force
A metal magnetic, multi-layer film technology, applied in the direction of metal material coating process, coating, ion implantation plating, etc., can solve the problems of increased production cost, unfavorable application, and small increase in film coercivity. Low cost, small thickness, good perpendicular magnetic anisotropy effect
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[0009] like figure 1 , the sputtering process conditions of curve (a) are: the background vacuum degree of the sputtering chamber is 1×10 -5 Pa, the pressure of argon (99.99%) was 0.9 Pa during sputtering. During the sputtering process, a magnetic field perpendicular to the direction of the film surface is applied to the surface of the substrate, with a magnitude of 100 Oe, and the substrate rotates at a rate of 18 r / min; the substrate temperature is 100 °C, and the deposition temperature of the FeMn layer is 10 °C;
[0010] The sputtering process conditions of curve (b) are: the background vacuum degree of the sputtering chamber is 3×10 -5 Pa, argon (99.99%) pressure was 1.2 Pa during sputtering. During the sputtering process, a magnetic field perpendicular to the direction of the film surface was applied to the surface of the substrate, with a magnitude of 700 Oe, and the substrate was rotated at a rate of 18 r / min; the substrate temperature was 200 °C, and the deposition ...
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