Sound wave sensing method and apparatus with integrated micro flow passage

A technology for acoustic wave sensing and manufacturing method, which is applied in the measurement of ultrasonic/sonic/infrasonic waves, measurement devices, and the use of sonic/ultrasonic/infrasonic waves to analyze fluids, etc. , thin film structure and other problems

Inactive Publication Date: 2009-10-14
IND TECH RES INST
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0007] In view of this, the purpose of the present invention is to solve the problems of existing acoustic wave sensing devices such as poor piezoelectric properties, fragile film structures or poor stability.

Method used

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  • Sound wave sensing method and apparatus with integrated micro flow passage
  • Sound wave sensing method and apparatus with integrated micro flow passage
  • Sound wave sensing method and apparatus with integrated micro flow passage

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Embodiment Construction

[0046] see Figure 1A , Figure 1B and Figure 1C , the schematic diagrams of the acoustic wave sensing device with integrated microfluidic channels of the present invention under the etching side, the acoustic wave sensing device 10 utilizes a substrate 11 with piezoelectric properties, which is electromechanically polished or chemically etched (chromium gold can be used as the etching The mask is etched) The processing method makes the thickness of the substrate 11 in a certain substrate area of ​​the substrate 11 smaller than the transmission wavelength of the acoustic wave, and makes it possible to produce the acoustic wave transmission of the flat plate flexural wave (or Lamb wave) under the condition of vibration and boundary conditions . The substrate area where the thickness of the substrate 11 becomes thinner is used to generate sound waves or stress waves, and the substrate 11 can be used for acoustic wave sensing to detect gas phase or liquid phase molecules by usi...

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Abstract

The present invention provides an acoustic wave sensing device integrating a micro-channel, its manufacturing method and an acoustic wave sensor. The method uses a piezoelectric block as a substrate, and uses electromechanical or chemical processing to make its sensing area into a piezoelectric sensor. The electric thin plate, and then use the interdigitated electrode structure (Inter-digital transducer, IDT) to make it generate flat plate flexure waves. In the present invention, the microfluidic channel can be further integrated on the same substrate with piezoelectric properties by the same processing method or bonding method. The present invention utilizes new element manufacturing and design to produce elements with good piezoelectric characteristics, stable temperature compensation characteristics and firm structure, which will enable flat plate flexural waves to be applied to liquid state sensors. Therefore, the present invention can solve the problems of existing acoustic wave sensing devices such as poor piezoelectric characteristics and poor film structure.

Description

technical field [0001] The present invention provides an acoustic wave sensing device with an integrated micro-channel and its method, especially a sensor made of a piezoelectric block material as a substrate and processed by micro-electromechanical technology. It can be applied to the analysis of specific components in liquid and gas states. Background technique [0002] Due to the wave propagation characteristics of the flat plate flexural wave (Flexural Plate Wave, FPW), it has the characteristic of limited energy transmission in the liquid, so it is applied in the liquid sensor. Existing FPW components mainly use silicon substrates as a platform to grow piezoelectric thin films and complete the fabrication of components after etching. However, in practical applications, it is difficult to grasp the characteristics of growing multilayer thin films, and the piezoelectric properties of piezoelectric films are important parameters that determine the performance characterist...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01N29/02G01H11/00
Inventor 宋柏勋柯文旺郭乃豪谢佑圣
Owner IND TECH RES INST
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